M1AFS600-2FGG256I

The M1AFS600-2FGG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers approximately 13,824 logic elements, roughly 600,000 gates and approximately 110,592 bits of embedded memory, with 119 I/Os in a 256-LBGA package.

Built for industrial applications, the device supports surface-mount assembly, a core supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

• Core and Logic  Approximately 13,824 logic elements and about 600,000 gates provide the programmable fabric for custom digital designs.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM for intermediate storage and buffering.
• I/O and Package  119 I/Os in a 256-LBGA package; supplier device package referenced as 256-FPBGA (17×17) for compact system integration.
• Power  Core supply voltage range from 1.425 V to 1.575 V to match system power rails.
• Thermal and Grade  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance  Surface-mount device (SMD) packaging and RoHS compliance for modern manufacturing processes and environmental requirements.

Typical Applications

• Industrial control  Use where industrial operating temperature range and industrial-grade qualification are required for reliable operation.
• I/O-intensive interface modules  Leverage 119 I/Os and compact 256-LBGA packaging to implement dense interface and bridging logic in constrained board space.
• Custom digital logic and state machines  Implement tailored logic functions using approximately 13,824 logic elements and the available on-chip RAM for local storage.

Unique Advantages

• High logic capacity: Approximately 13,824 logic elements and about 600,000 gates enable complex custom logic implementations without external ASICs.
• On-chip memory: Approximately 110,592 bits of embedded RAM support buffering, small FIFOs and local data storage within the FPGA fabric.
• Compact, SMD-ready package: 256-LBGA (256-FPBGA, 17×17) offers a small footprint for board-level integration while providing significant I/O.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in harsh and temperature-variable environments.
• Regulatory and assembly readiness: RoHS compliance and surface-mount packaging simplify manufacturing and environmental compliance.

Why Choose M1AFS600-2FGG256I?

The M1AFS600-2FGG256I combines substantial logic capacity, on-chip memory and a high I/O count in a compact 256-LBGA package, packaged and rated for industrial use. Its specified core voltage range and surface-mount format make it suitable for embedded designs that require predictable electrical and thermal operating envelopes.

This FPGA is well suited to designers and procurement teams seeking an industrial-grade programmable device from Microchip Technology that balances logic density, embedded RAM and a broad operating temperature range for long-term deployments.

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