M1AFS600-2FGG256

The M1AFS600-2FGG256 is a Fusion® FPGA from Microchip Technology offering programmable logic, embedded memory, and a compact 256-LBGA package for commercial embedded designs. With 13,824 logic elements, approximately 0.11 Mbits of embedded RAM and 119 user I/O, it targets applications that need moderate-density programmable logic combined with on-chip memory and flexible I/O in a surface-mount form factor.

Designed for commercial-temperature operation and RoHS compliance, this device provides a balance of integration and package density for space-constrained systems requiring reconfigurable logic functionality.

Key Features

• Logic Density — 13,824 logic elements (equivalent to 600,000 gates) to implement custom digital logic and control functions.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) for data buffering, state storage, and small lookup tables.
• I/O Count — 119 user I/O pins to support multiple peripheral connections and interface requirements.
• Package & Mounting — 256-LBGA surface-mount package; supplier device package specified as 256-FPBGA (17×17) for compact board-level integration.
• Power — Core supply voltage range of 1.425 V to 1.575 V to match target system power rails.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead-free assembly processes.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and glue functions where a moderate number of logic elements and on-chip RAM are required.
• Protocol Bridging and I/O Expansion — Use available I/O and programmable logic to adapt and bridge serial or parallel interfaces in space-constrained products.
• User Interface and Control — Drive custom state machines, display control logic, and input processing for consumer and commercial devices.

Unique Advantages

• Moderate-density programmable logic: 13,824 logic elements and 600,000 gates enable complex control and glue logic without external ASICs.
• On-chip embedded memory: 110,592 bits of RAM provide local storage for buffers, FIFOs, and small tables, reducing external memory requirements.
• Flexible I/O count: 119 user I/O pins support a variety of peripheral and interface needs on a single device.
• Compact package: 256-LBGA (256-FPBGA 17×17) enables dense PCB layouts and surface-mount assembly.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suited to a wide range of commercial applications.
• RoHS compliant: Conforms to lead-free manufacturing requirements for contemporary assembly processes.

Why Choose M1AFS600-2FGG256?

The M1AFS600-2FGG256 delivers a balanced combination of logic capacity, embedded memory, and I/O in a compact 256-LBGA surface-mount package, making it well suited for commercial embedded designs that require reconfigurable logic without excessive board space. Its defined operating voltage range and commercial temperature rating simplify integration into standard power and thermal environments.

This Fusion® FPGA is a practical choice for engineers seeking a Medium-density programmable solution from Microchip Technology that supports moderate logic, local RAM, and a substantial number of I/Os while meeting RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for the M1AFS600-2FGG256.