M1AFS600-2FG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA |
|---|---|
| Quantity | 638 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1AFS600-2FG256 – Fusion FPGA, 119 I/O, 256-LBGA
The M1AFS600-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements and approximately 600,000 gates, together with on-chip embedded memory for configurable digital designs.
Packaged in a 256-LBGA (supplier device package: 256-FPBGA, 17×17) and specified for commercial operation (0 °C to 85 °C), the device supports a supply voltage range of 1.425 V to 1.575 V and is supplied in a surface-mount form factor. RoHS compliance is declared.
Key Features
- Core Logic 13,824 logic elements (equivalent to the device's logic fabric) and approximately 600,000 gates provide the FPGA's programmable compute capacity.
- Embedded Memory Approximately 0.11 Mbits of on-chip RAM bits (110,592 total RAM bits) for local data storage and buffering within user logic.
- I/O Count 119 available I/O pins to interface with external devices and peripherals.
- Power Supply Single supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
- Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount configuration for compact board integration.
- Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Compliance RoHS-compliant for environmental regulatory alignment.
Unique Advantages
- Configurable logic density: 13,824 logic elements and ~600,000 gates enable substantial custom logic implementation without external ASICs.
- On-chip memory for local buffering: ~0.11 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
- Generous I/O capacity: 119 I/Os allow flexible interfacing to sensors, peripherals, and system buses.
- Compact, solderable package: 256-LBGA (256-FPBGA, 17×17) supports high-density board designs while maintaining surface-mount manufacturability.
- Tight supply range: Defined voltage window (1.425 V to 1.575 V) helps ensure predictable power design and integration.
- Commercial temperature rating: Designed for systems and applications operating within 0 °C to 85 °C.
Why Choose M1AFS600-2FG256?
The M1AFS600-2FG256 positions itself as a compact, RoHS-compliant FPGA option that balances a substantial logic element count with on-chip memory and a high I/O count. Its defined supply range and commercial temperature rating make it suitable for a wide range of board-level digital designs requiring programmable logic and embedded memory.
For teams targeting moderate-density FPGA implementations where package compactness, I/O flexibility, and predictable power requirements matter, this Fusion FPGA offers an integration-focused solution backed by Microchip Technology's product lineage.
Request a quote or contact sales to discuss availability, pricing, and how the M1AFS600-2FG256 can fit your next design.

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