M1AFS600-2FG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

Quantity 638 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AFS600-2FG256 – Fusion FPGA, 119 I/O, 256-LBGA

The M1AFS600-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements and approximately 600,000 gates, together with on-chip embedded memory for configurable digital designs.

Packaged in a 256-LBGA (supplier device package: 256-FPBGA, 17×17) and specified for commercial operation (0 °C to 85 °C), the device supports a supply voltage range of 1.425 V to 1.575 V and is supplied in a surface-mount form factor. RoHS compliance is declared.

Key Features

  • Core Logic 13,824 logic elements (equivalent to the device's logic fabric) and approximately 600,000 gates provide the FPGA's programmable compute capacity.
  • Embedded Memory Approximately 0.11 Mbits of on-chip RAM bits (110,592 total RAM bits) for local data storage and buffering within user logic.
  • I/O Count 119 available I/O pins to interface with external devices and peripherals.
  • Power Supply Single supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
  • Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount configuration for compact board integration.
  • Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Compliance RoHS-compliant for environmental regulatory alignment.

Unique Advantages

  • Configurable logic density: 13,824 logic elements and ~600,000 gates enable substantial custom logic implementation without external ASICs.
  • On-chip memory for local buffering: ~0.11 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
  • Generous I/O capacity: 119 I/Os allow flexible interfacing to sensors, peripherals, and system buses.
  • Compact, solderable package: 256-LBGA (256-FPBGA, 17×17) supports high-density board designs while maintaining surface-mount manufacturability.
  • Tight supply range: Defined voltage window (1.425 V to 1.575 V) helps ensure predictable power design and integration.
  • Commercial temperature rating: Designed for systems and applications operating within 0 °C to 85 °C.

Why Choose M1AFS600-2FG256?

The M1AFS600-2FG256 positions itself as a compact, RoHS-compliant FPGA option that balances a substantial logic element count with on-chip memory and a high I/O count. Its defined supply range and commercial temperature rating make it suitable for a wide range of board-level digital designs requiring programmable logic and embedded memory.

For teams targeting moderate-density FPGA implementations where package compactness, I/O flexibility, and predictable power requirements matter, this Fusion FPGA offers an integration-focused solution backed by Microchip Technology's product lineage.

Request a quote or contact sales to discuss availability, pricing, and how the M1AFS600-2FG256 can fit your next design.

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