M1AFS600-2FG484

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 26 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AFS600-2FG484 – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The M1AFS600-2FG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded designs. It provides a fixed logic and memory structure with on-chip RAM, a high I/O count, and a compact BGA package to support a range of custom digital functions.

Key device attributes include approximately 600,000 gates, 13,824 logic elements, roughly 0.11 Mbits of embedded memory, 172 I/O, a 484-ball FPBGA package, a narrow core supply range, and commercial operating temperature and RoHS compliance for mainstream embedded applications.

Key Features

  • Core Logic  Approximately 600,000 gates and 13,824 logic elements provide substantial programmable logic capacity for custom digital designs.
  • On-chip Memory  Total RAM of 110,592 bits (approximately 0.11 Mbits) for implemented state, buffering, and small data storage requirements.
  • High I/O Count  172 general-purpose I/O pins enable connection to multiple peripherals, sensors, or external interfaces without immediate need for expansion logic.
  • Power Supply  Specified core voltage range of 1.425 V to 1.575 V to match systems designed around this supply domain.
  • Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor to support compact board layouts.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

  • Custom digital logic and prototyping  Use the device to implement bespoke state machines, data path logic, and proof-of-concept systems leveraging its logic element count and on-chip RAM.
  • Embedded system I/O consolidation  172 I/O pins allow consolidation of multiple peripheral interfaces onto a single FPGA for space- and BOM-efficient designs.
  • Control and glue logic  Suitable for providing programmable control, timing, and interface bridging within commercial embedded equipment operating in the specified temperature range.

Unique Advantages

  • Substantial programmable capacity: The combination of ~600,000 gates and 13,824 logic elements supports moderate-to-complex custom logic implementations without external ASICs.
  • On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM enables local storage of state and small data buffers, reducing external memory needs for certain use cases.
  • Generous I/O count: 172 I/O pins simplify board-level integration by enabling direct connections to many peripherals and interfaces.
  • Compact BGA package: 484-FPBGA (23×23) in a surface-mount format helps maintain a small PCB footprint while supporting high pin density.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product development and manufacturing.
  • Defined core supply window: A narrow 1.425 V to 1.575 V supply range provides predictable core-voltage requirements for power-supply planning.

Why Choose M1AFS600-2FG484?

The M1AFS600-2FG484 delivers a balanced mix of logic capacity, on-chip memory, and I/O density in a compact 484-BGA package for commercial embedded designs. Its specifications make it suitable for engineers seeking a programmable device to implement custom logic, consolidate interfaces, or prototype system functionality within a defined commercial temperature and supply domain.

Designed and supplied by Microchip Technology and RoHS compliant, this FPGA is appropriate for projects that require moderate gate density, a substantial number of I/Os, and a compact surface-mount package, backed by vendor documentation and support resources.

Request a quote or submit an inquiry to check pricing and availability for the M1AFS600-2FG484 and to discuss how it fits your design requirements.

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