M1AFS600-2FG484
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 26 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1AFS600-2FG484 – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA
The M1AFS600-2FG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded designs. It provides a fixed logic and memory structure with on-chip RAM, a high I/O count, and a compact BGA package to support a range of custom digital functions.
Key device attributes include approximately 600,000 gates, 13,824 logic elements, roughly 0.11 Mbits of embedded memory, 172 I/O, a 484-ball FPBGA package, a narrow core supply range, and commercial operating temperature and RoHS compliance for mainstream embedded applications.
Key Features
- Core Logic Approximately 600,000 gates and 13,824 logic elements provide substantial programmable logic capacity for custom digital designs.
- On-chip Memory Total RAM of 110,592 bits (approximately 0.11 Mbits) for implemented state, buffering, and small data storage requirements.
- High I/O Count 172 general-purpose I/O pins enable connection to multiple peripherals, sensors, or external interfaces without immediate need for expansion logic.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V to match systems designed around this supply domain.
- Package & Mounting 484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor to support compact board layouts.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and manufacturing consistency.
Typical Applications
- Custom digital logic and prototyping Use the device to implement bespoke state machines, data path logic, and proof-of-concept systems leveraging its logic element count and on-chip RAM.
- Embedded system I/O consolidation 172 I/O pins allow consolidation of multiple peripheral interfaces onto a single FPGA for space- and BOM-efficient designs.
- Control and glue logic Suitable for providing programmable control, timing, and interface bridging within commercial embedded equipment operating in the specified temperature range.
Unique Advantages
- Substantial programmable capacity: The combination of ~600,000 gates and 13,824 logic elements supports moderate-to-complex custom logic implementations without external ASICs.
- On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM enables local storage of state and small data buffers, reducing external memory needs for certain use cases.
- Generous I/O count: 172 I/O pins simplify board-level integration by enabling direct connections to many peripherals and interfaces.
- Compact BGA package: 484-FPBGA (23×23) in a surface-mount format helps maintain a small PCB footprint while supporting high pin density.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product development and manufacturing.
- Defined core supply window: A narrow 1.425 V to 1.575 V supply range provides predictable core-voltage requirements for power-supply planning.
Why Choose M1AFS600-2FG484?
The M1AFS600-2FG484 delivers a balanced mix of logic capacity, on-chip memory, and I/O density in a compact 484-BGA package for commercial embedded designs. Its specifications make it suitable for engineers seeking a programmable device to implement custom logic, consolidate interfaces, or prototype system functionality within a defined commercial temperature and supply domain.
Designed and supplied by Microchip Technology and RoHS compliant, this FPGA is appropriate for projects that require moderate gate density, a substantial number of I/Os, and a compact surface-mount package, backed by vendor documentation and support resources.
Request a quote or submit an inquiry to check pricing and availability for the M1AFS600-2FG484 and to discuss how it fits your design requirements.

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