M1AFS600-1FGG484K

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 1,150 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 100°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1AFS600-1FGG484K – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The M1AFS600-1FGG484K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for applications that require reconfigurable digital logic in a compact ball grid array package. This device provides 13,824 logic elements, approximately 110,592 bits of on-chip RAM and 172 user I/O in a 484-ball FPBGA (23×23) surface-mount package.

With a specified supply voltage range of 1.425 V to 1.575 V and a military-grade operating temperature range of −55 °C to 100 °C, the part is suited to designs that demand robust thermal performance and long-term reliability.

Key Features

  • Core Logic  13,824 logic elements (LABs/CLBs) providing programmable logic density for implementing custom digital functions and control logic.
  • Gate Count  Approximately 600,000 gates to support complex logic implementations and system-level integration.
  • Embedded Memory  110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and local data processing.
  • I/O Resources  172 user I/O pins to interface with peripherals, sensors, and external logic within compact system designs.
  • Package & Mounting  484-ball FPBGA (23×23) surface-mount package providing a high-density footprint for space-efficient board layouts.
  • Power  Nominal supply voltage specified from 1.425 V to 1.575 V to match system power-rail requirements.
  • Temperature & Grade  Military grade device rated for operation from −55 °C to 100 °C to meet demanding thermal environments.
  • RoHS Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

  • Military and Defense Electronics  Military-grade temperature rating and rugged specifications make this FPGA appropriate for defense systems requiring reliable reconfigurable logic.
  • Rugged Embedded Systems  Use the 13,824 logic elements and 172 I/O to implement custom control, signal processing, and interface logic in embedded platforms exposed to wide temperature ranges.
  • Communications and Protocol Bridging  Leverage the on-chip RAM and abundant I/O to implement packet buffering, protocol conversion, and custom interface logic.
  • Hardware Acceleration and Custom Logic  Deploy the device’s gate count and logic resources to accelerate application-specific functions and offload tasks from general-purpose processors.

Unique Advantages

  • Military-Grade Reliability: Specified for −55 °C to 100 °C operation and designated as Military grade for applications with strict environmental requirements.
  • Significant Logic Capacity: 13,824 logic elements and ~600,000 gates enable substantial on-chip customization without immediate need for external logic.
  • On-Chip Memory for Local Data Handling: 110,592 bits of embedded RAM provide local buffering and state storage to support real-time processing tasks.
  • High I/O Count in a Compact Package: 172 user I/O in a 484-FPBGA (23×23) surface-mount package simplifies routing for multi-signal systems while conserving PCB area.
  • Tight Supply Voltage Specification: Defined supply range of 1.425 V to 1.575 V supports predictable power integration and system design.
  • RoHS Compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose M1AFS600-1FGG484K?

The M1AFS600-1FGG484K balances substantial programmable logic capacity with on-chip memory and a high I/O count in a space-efficient 484-FPBGA package. Its specified supply voltage range and military-grade temperature rating make it a practical choice for engineers designing robust, reconfigurable systems that must operate across wide thermal conditions.

This device is well suited for projects that require a combination of logic density, local memory, and numerous I/O lines, including defense, rugged embedded platforms, communications, and hardware acceleration tasks where long-term reliability and predictable electrical characteristics are important.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AFS600-1FGG484K. Our team can provide the next steps for procurement and integration into your project.

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