M1AFS600-1FGG256K

The M1AFS600-1FGG256K is a Fusion® Field Programmable Gate Array (FPGA) offered by Microchip Technology. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory in a compact 256-LBGA package.

Designed for applications that require military-grade temperature performance and a mid-range combination of logic density and I/O, this surface-mount FPGA operates from 1.425 V to 1.575 V and across an extended temperature range.

Key Features

• Core Logic 13,824 logic elements (reported as 13,824 logic element cells) delivering a total of 600,000 gates for implementing mid-complexity digital logic.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small on-chip data structures.
• I/O Capacity 119 I/O pins to support peripheral interfacing and board-level connectivity requirements.
• Power Operates from a core supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting 256-LBGA package (supplier designation 256-FPBGA, 17×17) in a surface-mount form factor for space-constrained PCBs.
• Temperature & Grade Military grade with an operating temperature range of −55 °C to 100 °C for extended-temperature deployment.
• Regulatory RoHS compliant.

Typical Applications

• Military and Aerospace Systems — Deployments requiring military-grade components and an operating range of −55 °C to 100 °C.
• Embedded Control and Interface — Designs that need around 119 I/O and 13,824 logic elements to implement control logic and protocol interfacing on a single device.
• Compact, High-Density Boards — Space-constrained hardware where the 256-LBGA, surface-mount package supports high integration in a small footprint.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates provide the capacity for moderate to complex logic implementations without excessive device overhead.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM supports buffering and small data storage needs directly on the FPGA die.
• Generous I/O Count: 119 I/O pins enable flexible peripheral connections and board-level integration options.
• Extended Temperature Performance: Rated from −55 °C to 100 °C and specified as military grade for temperature-sensitive and mission-critical applications.
• Compact SMT Package: 256-LBGA (256-FPBGA, 17×17) surface-mount package allows dense PCB layouts and reduced BOM complexity.
• RoHS Compliance: Meets RoHS requirements for material compliance in regulated manufacturing environments.

Why Choose M1AFS600-1FGG256K?

The M1AFS600-1FGG256K positions itself as a mid-density, military-grade FPGA that combines 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 119 I/O in a compact 256-LBGA package. Its operating voltage range and extended temperature specification make it suitable for designs where reliable operation across challenging thermal environments is required.

This device is well suited for engineers and procurement teams seeking a surface-mount FPGA with a balance of logic capacity, I/O, and rugged temperature capability for military and other extended-temperature applications.

Request a quote or submit a procurement inquiry to evaluate the M1AFS600-1FGG256K for your next design.