M1AFS600-1FG484K

The M1AFS600-1FG484K is a Fusion® FPGA from Microchip Technology delivering mid-range programmable logic with a military grade temperature and packaging profile. It provides 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and up to 172 I/O in a 484-BGA (484-FPBGA 23×23) surface-mount package.

Designed for applications requiring robust environmental performance and moderate logic capacity, this device combines substantial gate count and I/O connectivity with an extended operating temperature range and RoHS compliance.

Key Features

• Core / Logic: 13,824 logic elements and 600,000 gates provide the programmable fabric for custom logic, glue, and control functions.
• Embedded Memory: 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small data structures.
• I/O Capability: 172 user I/O pins support extensive interfacing to external devices and peripherals.
• Power: Core voltage supply range of 1.425 V to 1.575 V to define power design and regulator selection.
• Package & Mounting: 484-BGA in a 484-FPBGA (23×23) format, surface-mountable for compact PCB implementations.
• Environmental & Grade: Military grade with an operating temperature range of –55 °C to 100 °C and RoHS compliance for environmental standards.

Typical Applications

• Military & Aerospace Systems: Military-grade rating and –55 °C to 100 °C operation make it suitable for electronics that must perform across extreme temperature ranges.
• Industrial Control: 172 I/O and 13,824 logic elements enable control, monitoring, and I/O aggregation in industrial automation and equipment control units.
• Communications & Networking: 600,000 gates and embedded RAM support protocol handling, interface logic, and mid-range packet processing tasks.
• Custom Embedded Systems: Compact 484-BGA packaging and surface-mount mounting simplify integration into space-constrained, rugged embedded designs.

Unique Advantages

• Extended Temperature Range: Rated from –55 °C to 100 °C for reliable operation in harsh and wide-temperature environments.
• Balanced Logic Density: 13,824 logic elements and 600,000 gates deliver ample capacity for mid-range FPGA designs without excessive overhead.
• Generous I/O Count: 172 I/O pins provide flexible connectivity for sensors, peripherals, and external interfaces.
• Compact High-Density Package: 484-FPBGA (23×23) offers a high pin count in a compact surface-mount footprint for PCB real estate efficiency.
• Defined Power Envelope: Core supply range of 1.425 V–1.575 V supports stable power planning for system designs.
• Regulatory Compliance: RoHS compliant to meet environmental and manufacturing requirements.

Why Choose M1AFS600-1FG484K?

The M1AFS600-1FG484K positions itself as a reliable, mid-capacity Fusion® FPGA option for engineers who need a combination of moderate logic resources, substantial I/O, and rugged environmental performance. Its military grading and extended temperature range make it appropriate for harsh-environment applications, while its 484-BGA footprint supports compact, high-density designs.

This part is well suited to teams designing military, aerospace, industrial, and embedded systems that require predictable power characteristics, a clear I/O count, and on-chip RAM for lightweight buffering. Backed by Microchip Technology’s Fusion family, it offers a pragmatic balance of integration, robustness, and design flexibility.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the M1AFS600-1FG484K.