M1AFS600-1FG256K

The M1AFS600-1FG256K is a Fusion® Field Programmable Gate Array (FPGA) IC offering a balance of on-chip logic, embedded memory, and I/O density in a compact 256-LBGA package. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded RAM to implement custom digital functions and control logic.

Built and graded for military use, this surface-mount FPGA supports an extended operating range and a narrow core supply window, making it appropriate for designs that require both robust environmental tolerance and defined power requirements.

Key Features

• Core Logic  13,824 logic elements (cells) providing up to 600,000 gates for implementing complex programmable logic.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) to support buffering, state storage, and small data structures without external memory.
• I/O Density  119 general-purpose I/Os to support a variety of interface and peripheral connections directly from the FPGA fabric.
• Power  Defined core supply range of 1.425 V to 1.575 V to match precise power sequencing and supply design requirements.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Military grade with operating temperature range from −55°C to 100°C for applications requiring extended environmental tolerance.
• Regulatory  RoHS compliant.

Typical Applications

• Military and Defense Systems  Military-grade temperature range and packaging make this FPGA suitable for rugged embedded processing and control functions in defense electronics.
• Embedded Control and Custom Logic  Use the 13,824 logic elements and on-chip RAM to implement deterministic control algorithms, state machines, and custom peripheral logic.
• I/O-Intensive Interface Designs  With 119 I/Os, the device can handle multiple parallel interfaces, signal routing, and I/O expansion tasks on a single FPGA.

Unique Advantages

• High on-chip integration: Combines substantial logic capacity and embedded RAM to reduce reliance on external components and simplify system BOM.
• Deterministic power envelope: Narrow core voltage range (1.425 V–1.575 V) supports predictable power design and supply sequencing.
• Rugged environmental performance: Military grade and extended −55°C to 100°C operating temperature provide robustness for demanding deployments.
• Compact package: 256-LBGA (256-FPBGA, 17×17) surface-mount package enables high-density board layouts while preserving I/O count.
• RoHS compliant: Meets common materials compliance requirements for modern electronics manufacturing.

Why Choose M1AFS600-1FG256K?

The M1AFS600-1FG256K positions itself as a durable, mid-density Fusion® FPGA option for designs that need a combination of programmable logic, embedded memory, and significant I/O capacity in a compact package. Its military grade and extended operating temperature range support deployment in harsh environments where reliability and predictable electrical behavior are required.

This device is appropriate for engineers and procurement teams specifying FPGAs for rugged embedded systems, interface aggregation, and custom logic implementations that benefit from integrated memory and a defined core supply range.

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