M1AFS600-1FG256I

The M1AFS600-1FG256I is a Fusion® field programmable gate array (FPGA) designed for industrial applications. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory for implementing custom digital functions, control logic, and data buffering.

This surface-mount FPGA is supplied in a 256-LBGA package (256-FPBGA, 17×17) and offers 119 I/O, a nominal core voltage range of 1.425 V to 1.575 V, and an industrial operating range from −40 °C to 100 °C, making it suitable for designs that require robust environmental performance and flexible logic resources.

Key Features

• Core Logic  13,824 logic elements provide programmable fabric for implementing custom state machines, control paths, and combinational logic.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data buffering, FIFOs, and small lookup tables.
• I/O Capacity  119 general-purpose I/O pins for interfacing with sensors, peripherals, and external logic.
• Gate Count  Approximately 600,000 gates to support moderate-complexity designs.
• Power Supply  Core voltage supply range of 1.425 V to 1.575 V to match system power domains.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade  Operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• RoHS Compliant  Device meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control  Programmable logic and I/O capacity enable custom motor control, sequencing, and automation functions across a wide temperature range.
• Embedded System Glue Logic  Use the FPGA to consolidate discrete logic, protocol adapters, and timing resources, reducing board complexity and BOM count.
• Sensor Data Aggregation  On-chip memory and I/O allow aggregation and preprocessing of sensor data before passing to a host processor.
• Custom Interface Implementation  Implement application-specific interfaces and timing-critical logic using the available logic elements and I/O resources.

Unique Advantages

• Balanced Logic and Memory  13,824 logic elements combined with approximately 0.11 Mbits of embedded RAM provide a practical mix for moderate-complexity designs without external memory.
• Industrial Readiness  Rated for −40 °C to 100 °C operation and offered in a surface-mount 256-LBGA package for deployment in industrial equipment.
• Compact, High-Density Package  256-FPBGA (17×17) package supports dense integration on space-constrained PCBs.
• Predictable Power Domain  Defined core voltage range (1.425 V to 1.575 V) simplifies power supply design and integration into existing systems.
• Regulatory Compliance  RoHS compliance supports environmentally conscious manufacturing and global product requirements.

Why Choose M1AFS600-1FG256I?

The M1AFS600-1FG256I positions itself as a capable, industrial-grade FPGA option for engineers who need a balanced combination of logic density, on-chip memory, and I/O in a compact LBGA package. Its specified operating temperature range and RoHS compliance make it suitable for deployed systems that require durability and regulatory alignment.

This device is well suited to design teams implementing mid-range programmable logic, custom interfaces, and sensor or control aggregation where board space, environmental tolerance, and a clear power specification are important considerations.

Request a quote or submit a pricing inquiry to evaluate the M1AFS600-1FG256I for your next design project.