M1AFS250-FGG256

The M1AFS250-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 256‑ball LBGA package. It provides reconfigurable digital logic resources and on-chip memory suitable for commercial embedded applications where compact integration and flexible I/O are required.

With 6,144 logic elements, 36,864 bits of embedded RAM and 114 I/O pins, this device targets designs that need moderate logic capacity, local memory and a well‑integrated I/O footprint in a surface‑mount 17 × 17 mm package.

Key Features

• Logic Capacity  Provides 6,144 logic elements (cells) supporting a range of custom digital functions and control logic.
• On‑chip Memory  Includes 36,864 total RAM bits for embedded data storage and buffering within the FPGA fabric.
• I/O Count  Offers 114 general‑purpose I/O pins to interface with peripherals, sensors and external devices.
• Gate Density  Approximately 250,000 gates, enabling moderately complex logic implementations.
• Power  Operates from a core supply voltage range of 1.425 V to 1.575 V to match system power rails.
• Package & Mounting  256‑LBGA (256‑FPBGA, 17 × 17 mm) surface‑mount package for compact board integration.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS‑compliant, supporting regulated manufacturing requirements.

Typical Applications

• Custom Digital Logic  Implement application‑specific processing, state machines and glue logic using the device’s 6,144 logic elements and on‑chip RAM.
• Embedded Control  Use the FPGA for control tasks and local decision making in commercial embedded systems that operate within 0 °C to 85 °C.
• I/O Expansion and Interface Bridging  Leverage 114 I/O pins to consolidate peripheral interfaces and bridge between different device standards on a compact board footprint.

Unique Advantages

• Balanced Logic-and‑Memory Mix:  6,144 logic elements paired with 36,864 bits of RAM provide a practical balance for mid‑range logic and buffering needs.
• Compact, High‑Density Package:  The 256‑LBGA (17 × 17 mm) package minimizes PCB area while delivering substantial I/O count for system integration.
• Controlled Power Requirements:  A defined core voltage window (1.425 V–1.575 V) simplifies power supply design and margining.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation to match many consumer and commercial embedded product environments.
• Regulatory Compliance:  RoHS‑compliant construction supports adherence to environmental regulations in production.

Why Choose M1AFS250-FGG256?

The M1AFS250-FGG256 positions itself as a compact, mid‑capacity FPGA option from Microchip Technology, delivering 6,144 logic elements, 36,864 bits of embedded RAM and 114 I/Os in a 256‑ball LBGA. Its combination of gate count, on‑chip memory and I/O density makes it well suited for commercial embedded designs that require flexible, reconfigurable logic in a small package.

Engineers and procurement teams looking for a commercially rated FPGA with clear supply voltage and temperature specifications can rely on this Fusion® device for predictable integration into product designs, with RoHS compliance addressing environmental manufacturing requirements.

Request a quote or submit a product inquiry to evaluate the M1AFS250-FGG256 for your next design project.