M1AFS600-1FG256

The M1AFS600-1FG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology delivered in a 256-LBGA package. This device provides mid-range programmable logic capacity and embedded memory with a substantial I/O count, targeted for commercial electronic designs.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded RAM (110,592 bits), and 119 user I/Os. The device operates from a 1.425 V to 1.575 V core supply, is surface-mount packaged, and is specified for commercial temperatures (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Logic Capacity 13,824 logic elements providing the programmable logic resource for custom digital designs; approximately 600,000 equivalent gates.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, state storage, and small data structures.
• I/O Resources 119 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
• Power Core supply voltage range of 1.425 V to 1.575 V to match system power-rail requirements.
• Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17 × 17 mm) designed for surface-mount assembly to minimize PCB area.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for standard commercial electronics.
• Compliance RoHS compliant for environmentally conscious manufacturing.

Typical Applications

• Embedded Logic and Glue-Logic Implement custom combinational and sequential logic to consolidate glue logic and interface control within a compact FPGA.
• Protocol Bridging Use available I/O and logic elements to implement protocol translation and data-path control between subsystems.
• Interface Concentration Leverage 119 I/Os to aggregate multiple device interfaces or expand board-level connectivity without increasing component count.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of RAM enable mid-range programmable functions with local data storage.
• High I/O Density: 119 I/Os provide flexibility for interfacing multiple peripherals and signals directly to the FPGA.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17 × 17 mm) helps minimize PCB footprint while supporting high pin counts.
• Narrow Core Voltage Range: Defined 1.425 V to 1.575 V supply range simplifies power-supply design and integration with tightly specified rails.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet typical commercial product temperature requirements.
• RoHS Compliant: Meets RoHS requirements for environmentally compliant manufacturing.

Why Choose M1AFS600-1FG256?

The M1AFS600-1FG256 positions itself as a compact, mid-range Fusion® FPGA option from Microchip Technology, combining 13,824 logic elements, a modest block of embedded RAM, and 119 I/Os in a 256-LBGA package. Its electrical and thermal specifications make it suitable for mainstream commercial electronics where programmable logic, interface density, and a small board footprint are priorities.

Choose this part when you need a programmable device that balances logic capacity, I/O count, and embedded memory while remaining RoHS compliant and compatible with surface-mount assembly processes.

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