M1AFS600-1FG484I

The M1AFS600-1FG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It combines a high logic element count, on-chip memory, and a large I/O complement in a compact 484‑ball BGA package.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 bits), 172 I/O pins and a 1.425 V–1.575 V core supply range, this device targets systems that require moderate to high logic integration, flexible I/O and industrial temperature operation.

Key Features

• Core & Logic  13,824 logic elements and approximately 600,000 gates provide on-chip resources for implementing custom logic and control functions.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, state machines and small lookup tables.
• I/O Density  172 user I/O pins to support parallel interfaces, sensor connections and mixed-signal front-end routing.
• Power  Core supply range of 1.425 V to 1.575 V to match targeted FPGA core voltage domains.
• Package & Mounting  484‑ball FPBGA (23 × 23) package, surface-mount mounting type, offering a compact footprint for board-level integration.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for many industrial environments.
• Regulatory Compliance  RoHS compliant, meeting common environmental compliance requirements for electronics assemblies.

Typical Applications

• Industrial Control  Implement motor control logic, timing and custom control functions that benefit from the device’s logic density and industrial temperature rating.
• Sensor and I/O Aggregation  Aggregate and interface multiple sensors or peripheral devices using the device’s 172 I/O pins and on-chip memory for buffering.
• Custom Protocol Bridging  Create protocol converters or interface bridges where dedicated logic, flexible I/O and embedded memory simplify board-level design.
• Embedded System Glue Logic  Replace discrete logic with programmable logic to reduce BOM and centralize custom timing and control functions.

Unique Advantages

• High Logic Capacity: 13,824 logic elements enable consolidation of multiple functions into a single device.
• Sufficient On-Chip Memory: Approximately 0.11 Mbits of embedded RAM supports buffering and small data structures without external memory.
• Large I/O Count: 172 I/O pins provide flexibility for parallel interfaces, GPIOs and mixed-signal routing needs.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Compact BGA Footprint: 484‑ball FPBGA (23 × 23) surface-mount package enables dense board integration while maintaining robust signal routing.
• RoHS Compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose M1AFS600-1FG484I?

The M1AFS600-1FG484I delivers a balance of logic capacity, on-chip memory and high I/O count in a compact 484‑ball BGA package, making it well suited for industrial and embedded designs that require moderate to high integration. Its specified core voltage range and industrial temperature rating help ensure predictable integration into controlled power and thermal environments.

Produced by Microchip Technology, this Fusion® FPGA is a practical choice for engineers looking to consolidate glue logic, implement custom interfaces, or centralize control functions while keeping board area and component count down.

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