M1AFS600-1FGG256

The M1AFS600-1FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It provides a balanced mix of logic capacity, on-chip memory and I/O density in a compact 256-LBGA surface-mount package for space-constrained system designs.

With 13,824 logic elements (CLBs), approximately 110,592 bits of embedded RAM, and 119 user I/O, this device is suitable for custom digital logic, interface bridging and mid-density processing tasks where a commercial-grade FPGA solution is required.

Key Features

• Logic Capacity — 13,824 logic elements (CLBs) and approximately 600,000 gates provide mid-range programmable logic resources for custom digital designs.
• Embedded Memory — Approximately 110,592 bits of on-chip RAM to support buffering, lookup tables and small data storage requirements within the FPGA fabric.
• I/O Resources — 119 user I/O pins to support multiple external interfaces and peripheral connections.
• Package and Mounting — 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Power — Operates from a core voltage supply range of 1.425 V to 1.575 V, allowing precise power sequencing and design margining.
• Operating Conditions — Commercial temperature rating from 0 °C to 85 °C for typical commercial environment deployments.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Custom Digital Logic — Implement glue logic, state machines and protocol handling for commercial embedded products.
• I/O Expansion & Interface Bridging — Aggregate and translate multiple peripheral interfaces using the device’s 119 I/O pins.
• Prototyping and Development — Evaluate mid-density FPGA designs and iterate firmware/hardware integration in commercial product development.
• Control and Timing Functions — Implement on-chip control logic, timing generation and synchronization tasks using available logic and embedded RAM.

Unique Advantages

• Balanced Logic and Memory — Combines 13,824 logic elements with approximately 110,592 bits of RAM to support a wide range of mid-density designs without external memory for small data sets.
• Significant I/O Count — 119 I/O pins enable flexible interfacing to multiple peripherals and external devices, reducing the need for additional I/O expanders.
• Compact, Board-Friendly Package — 256-LBGA (17×17 FPBGA footprint) surface-mount package facilitates high-density PCB integration in space-limited applications.
• Controlled Power Envelope — Narrow core voltage range (1.425 V–1.575 V) supports predictable power design and simplifies power-supply selection.
• Commercial Temperature Rating — Designed for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS Compliant — Meets lead-free manufacturing requirements for environmental compliance.

Why Choose M1AFS600-1FGG256?

The M1AFS600-1FGG256 positions itself as a commercial-grade Fusion FPGA that delivers mid-range programmable logic, modest embedded memory and substantial I/O in a compact 256-LBGA package. It is well suited for engineers building commercial embedded systems that require on-chip logic and memory integration without large external components.

Backed by Microchip Technology manufacturing, this device offers a practical balance of performance, integration and form factor for prototyping, control logic and interface consolidation tasks, enabling streamlined board designs and predictable integration paths for commercial products.

Request a quote or submit an inquiry to receive pricing and availability information for the M1AFS600-1FGG256.