M1AFS600-1FGG484I

The M1AFS600-1FGG484I is a Fusion® field programmable gate array from Microchip Technology featuring mid-range logic density and integrated on-chip memory. It combines approximately 13,824 logic elements with roughly 110,592 bits of embedded memory and 172 user I/O pins in a 484-ball FPBGA package designed for surface-mount assembly.

Specified for industrial use, with a supply voltage window of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, this device is intended for designs that require configurable logic, significant I/O count, and a compact BGA form factor.

Key Features

• Core logic  Approximately 13,824 logic elements (equivalent cells) delivering a logic capacity of 600,000 gates for mid-range FPGA integration.
• Embedded memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for storing state, buffers, and lookup data without external memory.
• I/O density  172 user I/O pins to support multiple interfaces and parallel connections directly from the FPGA fabric.
• Power  Nominal core supply range of 1.425 V to 1.575 V to match board-level power domains and regulator designs.
• Package and mounting  484-ball FPBGA (23 × 23) package, surface-mountable, providing a compact footprint for space-constrained PCBs.
• Industrial temperature rating  Qualified for operation from −40 °C to 100 °C to meet temperature requirements in industrial environments.
• Compliance  RoHS-compliant material content to support regulatory and environmental requirements.

Typical Applications

• Industrial control  Use the FPGA’s logic capacity and 172 I/Os for motor control, PLC companion logic, and real-time signal aggregation in industrial systems operating across a wide temperature range.
• Embedded system glue logic  Consolidate interface translation, custom peripherals, and timing-critical functions on-chip to simplify board-level design and reduce external components.
• Communication interfaces  Implement parallel bus bridging, I/O multiplexing, and protocol adaptation leveraging abundant I/O and embedded RAM for buffering and state machines.

Unique Advantages

• Balanced logic and memory  Combines roughly 13,824 logic elements with ~0.11 Mbits of embedded memory to support both control logic and local buffering in a single device.
• High I/O count  172 I/Os enable direct connection to multiple peripherals and external devices, reducing the need for external I/O expanders.
• Industrial-grade thermal range  Rated from −40 °C to 100 °C for deployment in temperature-challenging industrial environments.
• Compact BGA footprint  484-FPBGA (23×23) package supports dense PCB layouts while providing the pin count required for complex designs.
• Controlled core supply  Defined 1.425 V–1.575 V supply window helps predictable power integration with board-level regulators.
• RoHS compliant  Material compliance simplifies environmental qualification for commercial and industrial products.

Why Choose M1AFS600-1FGG484I?

The M1AFS600-1FGG484I positions itself as a mid-range Fusion® FPGA solution from Microchip Technology, delivering a combination of logic density, embedded memory, and a high I/O count in a compact 484-BGA package. Its industrial operating range and defined core voltage make it suitable for designers targeting robust embedded and industrial applications that require configurable logic and substantial on-chip resources.

Choose this device when your design needs roughly 600,000 gates, around 13,824 logic elements, significant I/O capability, and on-chip RAM in a surface-mount BGA form factor backed by RoHS compliance.

Request a quote or contact sales to discuss availability, pricing, and sample options for the M1AFS600-1FGG484I.