M1AFS250-2FGG256

The M1AFS250-2FGG256 is a Fusion® Field Programmable Gate Array optimized for commercial embedded logic designs. It provides a balanced combination of configurable logic, embedded memory and a moderate I/O count to support a wide range of commercial applications requiring on-chip programmability.

With 6,144 logic elements, approximately 0.037 Mbits of embedded memory and 114 I/Os housed in a 256-LBGA package, this device delivers a compact, low-voltage solution for designers targeting commercial-temperature environments.

Key Features

• Core Logic 6,144 logic elements (CLBs) and approximately 250,000 gates provide the programmable fabric for custom digital functions.
• Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) to support local data buffering and state storage.
• I/O Capacity 114 user I/Os to interface with peripherals, sensors and external devices.
• Power Supported core supply range from 1.425 V to 1.575 V for low-voltage system integration.
• Package & Mounting 256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact board-level integration.
• Operating Conditions Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant for environmental and material compliance.

Typical Applications

• Commercial Embedded Systems Implement custom logic and peripheral control functions where a commercial-grade FPGA with moderate logic and I/O is required.
• Interface and Glue Logic Serve as protocol bridging or glue logic between multiple digital subsystems using available I/Os and configurable logic elements.
• Prototyping and Development Rapidly develop and validate digital designs that benefit from on-chip reconfigurability and embedded RAM.

Unique Advantages

• Highly configurable logic: 6,144 logic elements and ~250,000 gates let designers implement diverse digital functions without external ASICs.
• Compact package: 256-LBGA (17×17) footprint enables space-efficient mounting on dense PCBs while maintaining ample I/O.
• Moderate embedded memory: 36,864 bits of on-chip RAM support local buffering and state retention for many control and interface tasks.
• Low-voltage core: 1.425 V to 1.575 V supply range aligns with modern low-voltage system architectures.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose M1AFS250-2FGG256?

The M1AFS250-2FGG256 positions itself as a pragmatic, commercial-grade FPGA choice for designers who need a mix of configurable logic, embedded RAM and a useful I/O complement in a compact BGA package. Its 6,144 logic elements, 114 I/Os and 256-LBGA form factor make it well suited to board-level designs that require on-chip flexibility without high-voltage or extended-temperature requirements.

For projects where predictable commercial-temperature operation, RoHS compliance and a low-voltage core are important, this Fusion® FPGA delivers a straightforward, integratable option with the programmability engineers expect from an FPGA device.

If you would like pricing, availability or a formal quote for M1AFS250-2FGG256, request a quote or submit an inquiry to receive further purchasing information and lead-time details.