M1AFS250-1FGG256

The M1AFS250-1FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade embedded applications. It provides a balance of programmable logic, on-chip memory and I/O density for designers needing moderate gate capacity and flexible interfacing in a compact 256‑LBGA package.

With 6,144 logic elements, approximately 0.037 Mbits of embedded RAM, 114 user I/O and a 1.425 V to 1.575 V core supply range, this FPGA is targeted at systems that require integrated programmable logic and reliable commercial-temperature operation (0 °C to 85 °C).

Key Features

• Core Logic 6,144 logic elements (cells) delivering approximately 250,000 gates of programmable logic capacity for implementing custom logic functions and state machines.
• Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) to support small data buffers, FIFOs and lookup tables directly within the device.
• I/O Capability 114 user I/O pins to support a variety of parallel and serial interfaces and external device connections in I/O‑intensive designs.
• Power Defined core voltage supply range of 1.425 V to 1.575 V for predictable power planning and system integration.
• Package Supplier device package 256‑FPBGA (17×17), listed as 256‑LBGA, providing a compact surface-mount footprint for space‑constrained PCBs.
• Commercial Temperature Range Rated for 0 °C to 85 °C operation to meet standard commercial product environmental needs.
• Compliance RoHS compliant to support regulatory and environmental requirements for commercial electronics.

Typical Applications

• Embedded Control Implement control logic, protocol handling and glue logic for embedded systems that require configurable hardware acceleration.
• Consumer and Communications Devices Provide programmable I/O and moderate logic capacity for consumer electronics, network interfaces and peripheral controllers.
• Prototyping and Development Useful for developers creating and validating custom logic functions before committing to fixed silicon or higher-density FPGA parts.

Unique Advantages

• Balanced Logic and Memory: 6,144 logic elements paired with on-chip RAM support a wide range of finite-state machines and small buffering requirements without external memory.
• High I/O Count: 114 user I/Os enable flexible interfacing to sensors, peripherals and external buses, reducing the need for additional I/O expanders.
• Compact Package: 256‑LBGA (256‑FPBGA, 17×17) footprint helps save board space while maintaining accessible pinout density for complex designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant, supporting long-term deployment in standard commercial electronics.
• Predictable Power Integration: A defined core voltage window (1.425 V–1.575 V) simplifies power supply design and margining for system architects.

Why Choose M1AFS250-1FGG256?

The M1AFS250-1FGG256 positions itself as a practical, commercial-grade FPGA choice for designs that need moderate programmable logic, on-chip memory and generous I/O in a compact BGA footprint. Its combination of 6,144 logic elements, approximately 36,864 bits of embedded RAM and 114 I/Os makes it well suited for embedded control, consumer devices and development projects where integration and board area matter.

Backed by Microchip Technology and offered as a RoHS-compliant device, this FPGA supports predictable integration into commercial products and iterative development workflows, providing a scalable hardware resource for evolving designs.

Request a quote or contact sales to obtain pricing, lead times and availability for the M1AFS250-1FGG256.