M1AFS250-1FG256

The M1AFS250-1FG256 is a Fusion® field programmable gate array (FPGA) IC from Microchip Technology designed for commercial electronic designs requiring moderate logic capacity and flexible I/O. It combines 6,144 logic elements, approximately 0.037 Mbits of on-chip RAM, and 114 user I/O in a 256-pin BGA package for compact board-level integration.

This device targets general-purpose applications where a balance of logic resources, embedded memory, and a compact 256-LBGA footprint are important, while operating from a narrow core voltage range and within commercial temperature limits.

Key Features

• Logic Capacity  6,144 logic elements (CLBs) and approximately 250,000 gates provide the on-chip programmable logic for implementing custom digital functions.
• Embedded Memory  Approximately 0.037 Mbits (36,864 bits) of total on-chip RAM to support local data buffering and small LUT-based memory structures.
• I/O  114 user I/O pins deliver flexible interfacing options for peripherals, sensors, and external logic on constrained PCBs.
• Power  Core supply voltage range of 1.425 V to 1.575 V supports stable operation within a defined low-voltage envelope.
• Package & Mounting  256-LBGA package (supplier package: 256-FPBGA, 17 × 17 mm) with surface-mount mounting type for compact board layouts.
• Operating Conditions  Commercial grade device rated for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for regulatory and environmental compatibility in commercial production.

Typical Applications

• Embedded Control  Implement control logic and state machines where moderate logic density and local RAM are sufficient for device management and sequencing.
• Interface Bridging  Provide protocol translation, glue logic, or parallel-to-serial interfaces using abundant I/O and programmable logic.
• Prototyping & Development  Use in prototype boards and development systems that require a compact BGA package and a commercial temperature rating.
• Consumer & Commercial Electronics  Integrate custom processing, peripheral control, or simple signal processing functions in space-constrained products.

Unique Advantages

• Balanced Logic and Memory:  6,144 logic elements paired with on-chip RAM enable a range of mid-complexity designs without external memory.
• Ample I/O Density:  114 I/O pins allow multiple peripheral connections and flexible board-level integration.
• Compact Packaging:  256-LBGA (256-FPBGA, 17 × 17 mm) minimizes PCB real estate while supporting surface-mount assembly.
• Controlled Power Envelope:  Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design for consistent device operation.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C for mainstream commercial applications and environments.
• RoHS Compliant:  Meets required environmental compliance for commercial manufacturing processes.

Why Choose M1AFS250-1FG256?

The M1AFS250-1FG256 offers a practical combination of logic density, embedded memory, and I/O count in a compact 256-LBGA footprint suited for commercial designs. Its specification set makes it a good fit for engineers seeking a Fusion® FPGA device to implement mid-complexity digital functions, interface bridging, and embedded control without requiring larger, higher-cost devices.

Backed by Microchip Technology, this FPGA provides a clear path for scalable designs that need a reliable, RoHS-compliant programmable device within a controlled power and temperature envelope.

Request a quote or submit an inquiry today to discuss pricing and availability for the M1AFS250-1FG256.