M1AFS1500-FGG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA |
|---|---|
| Quantity | 827 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 223 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-FGG484I – Fusion® FPGA, 223 I/Os, 484-BGA
The M1AFS1500-FGG484I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers a high-density programmable fabric in a 484-ball fine-pitch BGA (23×23) surface-mount package.
With 1,500,000 gates, approximately 38,400 logic elements and 223 user I/Os, the device targets designs that require significant on-chip logic capacity, flexible I/O routing and extended temperature operation while remaining RoHS compliant.
Key Features
- Core Logic 1,500,000 gates and approximately 38,400 logic elements provide substantial programmable capacity for custom digital functions.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, state storage and local data processing.
- I/O Density 223 user I/Os to support broad peripheral connectivity and board-level interfacing.
- Package and Mounting 484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
- Power Supply Specified operating supply voltage from 1.425 V to 1.575 V to match precise power domains.
- Operating Range and Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployment.
- Environmental Compliance RoHS compliant to meet environmental and regulatory requirements.
Typical Applications
- Industrial Control Systems Implement custom control logic and I/O handling where extended temperature range and industrial grading are required.
- Embedded System Acceleration Offload compute-intensive or timing-sensitive tasks to hardware implemented across the device’s logic elements and on-chip RAM.
- Protocol Bridging and I/O Expansion Use the high I/O count to implement custom protocol converters, interface bridges and glue logic between subsystems.
- Production-Proof Designs Surface-mount 484-BGA packaging and RoHS compliance support compact, manufacturable board designs for volume production.
Unique Advantages
- High logic capacity: 1,500,000 gates and ~38,400 logic elements enable complex, integrated digital designs without immediate need for multiple devices.
- Compact, high-density packaging: 484-BGA (23×23) offers a small footprint for high-pin-count FPGA integration in space-constrained systems.
- Extensive I/O resources: 223 user I/Os reduce external multiplexing and simplify board-level signal routing for multi-peripheral systems.
- Embedded memory on-chip: Approximately 0.276 Mbits of RAM supports local buffering and state retention for performance-sensitive tasks.
- Industrial readiness: Specified for −40 °C to 100 °C operation, making it suitable for a wide range of industrial environments.
- Regulatory compliance: RoHS compliance supports environmental and supply-chain requirements.
Why Choose M1AFS1500-FGG484I?
The M1AFS1500-FGG484I positions itself as a high-capacity, industrial-grade FPGA solution from Microchip Technology that balances dense programmable logic, meaningful on-chip memory and broad I/O in a compact 484-BGA package. Its specified voltage supply range and extended operating temperature support robust designs for industrial and embedded applications.
This device is well suited for engineers and teams developing systems that require significant custom logic, numerous I/Os and manufacturable surface-mount packaging. Its combination of logic density, I/O resources and RoHS compliance provides a practical platform for scalable, production-ready FPGA-based designs.
Request a quote or submit a sales inquiry to obtain pricing, availability and lead-time information for the M1AFS1500-FGG484I.

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