M1AFS1500-FGG484

The M1AFS1500-FGG484 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 223 I/O in a compact 484-BGA package.

Designed as a commercial-grade, surface-mount FPGA, this device targets applications that require substantial on-chip logic density and a high I/O count within a constrained package and defined power and temperature envelopes.

Key Features

• Core Logic 38,400 logic elements and 1,500,000 gates provide a sizable resource pool for implementing programmable logic functions.
• Embedded Memory Approximately 0.276 Mbits of total on-chip RAM (276,480 bits) for temporary data storage and buffering.
• I/O Capacity 223 general-purpose I/O pins to support diverse peripheral and interface requirements.
• Package and Mounting 484-BGA in a 484-FPBGA (23 × 23) footprint optimized for surface-mount assembly.
• Power Supply Specified supply voltage range of 1.425 V to 1.575 V for core power planning.
• Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to meet common lead-free assembly requirements.

Unique Advantages

• High logic density: 38,400 logic elements and 1.5 million gates enable substantial programmable function integration on a single device.
• Embedded on-chip RAM: Approximately 0.276 Mbits of RAM reduces reliance on external memory for intermediate data and buffering.
• Large I/O complement: 223 I/O pins support extensive peripheral interfacing without additional I/O-expanders.
• Compact BGA footprint: 484-FPBGA (23 × 23) package allows high-density board layouts while remaining surface-mount friendly.
• <strongControlled power rail: Narrow supply range (1.425–1.575 V) simplifies core power sequencing and regulation design.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose M1AFS1500-FGG484?

The M1AFS1500-FGG484 balances substantial logic and memory resources with a high I/O count in a compact 484-BGA package, making it suitable for commercial designs that require integrated programmable logic and moderate on-chip RAM. Its defined supply voltage range and RoHS compliance aid predictable integration into production assemblies.

This Fusion® FPGA is well suited to design teams seeking a commercially rated, surface-mount programmable device that provides significant logic density and I/O capability without enlarging the PCB footprint.

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