M1AFS1500-FG676I

The M1AFS1500-FG676I is a Fusion® Field Programmable Gate Array (FPGA) packaged in a 676-ball BGA. This industrial-grade device provides a substantial logic resource set and on-chip memory for implementing custom digital logic, I/O-rich interfaces, and system glue logic in demanding environments.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, the device targets applications that require a balance of logic capacity, I/O density and industrial temperature operation.

Key Features

• Logic Capacity  38,400 logic elements and 1,500,000 gates for implementing complex custom logic and control functions.
• Embedded Memory  Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) to support buffering, state storage and small lookup tables.
• I/O Density  252 user I/Os to accommodate multiple parallel interfaces, external peripherals and board-level connectivity.
• Package & Mounting  676-FBGA (27 × 27) package, surface-mount mounting type, suitable for compact board layouts requiring high pin density.
• Power Supply  Specified core voltage range of 1.425 V to 1.575 V for device operation.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in industrial ambient conditions.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Leverages the industrial temperature range and extensive I/O to implement motor control logic, sensor aggregation and on-site automation functions.
• Interface Bridging  Use the 252 I/Os and abundant logic elements to implement protocol bridging, custom bus interfaces and peripheral aggregation.
• Embedded System Glue Logic  Deploy the logic elements and on-chip RAM for timing-critical glue logic between processors, memory and peripherals.
• Custom Data Handling  Implement application-specific packet processing, buffering and control paths using the device’s logic and embedded RAM resources.

Unique Advantages

• Substantial Logic Resource: 38,400 logic elements and 1,500,000 gates enable implementation of sizable custom logic functions without external ASICs.
• High I/O Count: 252 user I/Os simplify board-level connections and reduce the need for additional interface chips.
• Compact High-Density Package: The 676-FBGA (27×27) package delivers high pin count in a compact footprint for space-constrained designs.
• Industrial Operating Range: Rated for −40 °C to 100 °C, making the device suitable for industrial ambient conditions and factory-floor deployments.
• Controlled Core Supply: Narrow supply specification (1.425 V–1.575 V) supports predictable power design and regulator selection.
• Regulatory Compliance: RoHS compliance supports use in products requiring lead-free assembly processes.

Why Choose M1AFS1500-FG676I?

The M1AFS1500-FG676I positions itself as an industrial-grade FPGA option that combines a large logic element count, meaningful on-chip RAM and a high I/O complement in a compact 676-ball FBGA package. These characteristics make it well suited for engineers who need to implement custom digital logic, complex interfacing, or control functions while meeting industrial temperature requirements.

Designers looking for a balanced FPGA with clear electrical and environmental specifications will find this device appropriate for mid- to high-density logic integration, I/O-intensive designs, and applications where RoHS compliance and a compact BGA package are required.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AFS1500-FG676I.