M1AFS1500-FGG256K

The M1AFS1500-FGG256K is a Fusion® Field Programmable Gate Array (FPGA) packaged in a 256-LBGA surface-mount package. It provides a high-density logic resource with 38,400 logic elements and 1,500,000 gates, combined with on-chip embedded memory and flexible I/O for use in disciplined, rugged electronic designs.

Designed for applications that require military-grade qualification and extended temperature operation, this device targets designs where sustained performance across a wide thermal range and a compact BGA footprint are important.

Key Features

• Logic Capacity — 38,400 logic elements (equivalent cell count) delivering 1,500,000 gates for complex digital implementations and custom logic functions.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 bits) to support data buffering, state storage, and small local memory needs without external RAM.
• I/O Resources — 119 I/O pins to interface with peripherals, sensors, and other system components for flexible connectivity.
• Package & Mounting — 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact, board-level integration.
• Voltage Supply — Operates from 1.425 V to 1.575 V, enabling precise supply management for core logic.
• Temperature & Grade — Military grade with an operating temperature range of -55 °C to 100 °C for extended-environment operation and reliability.
• Mounting — Surface mount package suitable for typical PCB assembly processes for compact system designs.

Typical Applications

• Military and Defense Systems — Military-grade qualification and extended -55 °C to 100 °C operation make this FPGA suitable for defense electronics requiring reliable logic resources in harsh environments.
• Embedded Control and Processing — High logic element count and on-chip RAM support state machines, control logic, and protocol handling in compact embedded subsystems.
• Custom Interface and I/O Bridging — 119 I/O pins provide flexibility for implementing custom interfaces, signal conditioning, and protocol conversion between subsystems.
• Compact Board-Level Integration — The 256-LBGA, 17×17 FPBGA footprint enables dense PCB designs where board space and robust mounting are required.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates enable implementation of substantial custom logic without external programmable devices.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Extended Temperature Capability: Rated from -55 °C to 100 °C to support deployments in demanding thermal environments.
• Military Grade Assurance: Built and specified for military grade systems where rigorous environmental performance is required.
• Compact BGA Package: 256-LBGA (256-FPBGA, 17×17) provides a small board footprint while maintaining a high I/O count for system integration.
• Tight Core Voltage Range: 1.425 V to 1.575 V supply requirement supports controlled, predictable core operation.

Why Choose M1AFS1500-FGG256K?

The M1AFS1500-FGG256K positions itself as a high-capacity, military-grade FPGA option for designs that need substantial logic resources, embedded memory, and reliable operation across a wide temperature range. Its combination of 38,400 logic elements, 119 I/O, and a compact 256-LBGA footprint makes it well suited for engineers building rugged embedded systems and defense electronics where board space, environmental tolerance, and deterministic hardware logic are priorities.

For teams seeking a long-term, scalable logic platform, this FPGA offers predictable supply requirements, a clear thermal specification, and the integration density necessary to simplify designs and reduce external component count.

If you would like pricing, availability, or a formal quote for M1AFS1500-FGG256K, please request a quote or submit an inquiry to our sales team.