M1AFS1500-FGG676

The M1AFS1500-FGG676 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded designs that require configurable logic and substantial on-chip memory. It combines 38,400 logic elements with approximately 276,480 bits of embedded memory and up to 252 I/O pins to support complex, compact hardware implementations.

Packaged in a 676-ball FBGA (27 × 27) surface-mount package and rated for commercial temperature operation, this device targets applications that need medium-to-high logic density, flexible I/O, and controlled supply-voltage operation within 1.425 V to 1.575 V.

Key Features

• Core Logic Elements  38,400 logic elements (LEs) providing a foundation for custom digital logic and hardware acceleration.
• Gate Count  Approximately 1,500,000 gates to support sizable combinational and sequential logic designs.
• Embedded Memory  Approximately 276,480 bits of on-chip RAM for buffering, small data structures, and state storage.
• I/O Integration  252 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Package and Mounting  676-FBGA (27 × 27) surface-mount package for compact board integration and high pin count routing.
• Power  Operates from a supply range of 1.425 V to 1.575 V, enabling predictable power design within that rail.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental and manufacturability requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, protocol bridging, and interface adaptation using available logic elements and I/O.
• Communications Equipment  Use the device’s abundant I/O and logic resources for protocol handling and packet preprocessing in commercial network equipment.
• Test and Measurement  Deploy as a configurable data-path engine or custom timing/trigger logic in bench and automated test systems.
• Prototyping and Development  Rapidly iterate hardware designs that require moderate-to-high logic density and on-chip RAM for functional validation.

Unique Advantages

• Substantial Logic Capacity: 38,400 logic elements and ~1.5M gates provide headroom for complex hardware implementations without external logic expansion.
• Significant On-Chip Memory: Approximately 276,480 bits of embedded RAM reduce reliance on external memory for small buffers and state machines.
• High I/O Count: 252 I/O pins enable broad connectivity to peripherals and multiple interfaces on a single package.
• Compact High-Pin Package: The 676-FBGA (27 × 27) package allows dense routing and board-space efficient integration for higher-pin-count designs.
• Predictable Power Window: A defined supply range (1.425 V to 1.575 V) simplifies power-supply design and margin planning.
• Commercial-Grade Availability: Designed for commercial temperature operation and RoHS compliance to align with mainstream manufacturing requirements.

Why Choose M1AFS1500-FGG676?

The M1AFS1500-FGG676 is positioned for engineers who need a commercially graded, medium-to-high density FPGA with a balance of logic, embedded memory, and extensive I/O in a compact FBGA package. Its specifications make it suitable for commercial embedded systems, communications equipment, test platforms, and rapid prototyping where on-chip resources and a high pin count are valuable.

Backed by Microchip Technology’s Fusion® FPGA family, the device offers a clear specification set—logic capacity, memory, I/O, package, and power requirements—that supports scalable designs and predictable integration into commercial product development workflows.

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