M1AFS250-1FGG256I

The M1AFS250-1FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, offering a balance of logic density, I/O capacity, and compact packaging for industrial applications. It integrates 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 250,000 gates to support a range of custom logic and interfacing tasks.

Designed for surface-mount deployment in a 256-LBGA (256-FPBGA, 17×17) package, this industrial-grade device operates across a broad temperature range and a defined low-voltage supply window, making it suitable for robust embedded designs that require moderate programmable logic and substantial I/O.

Key Features

• Core Logic  6,144 logic elements and 250,000 gates provide programmable logic capacity for custom digital functions and control logic.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM for buffering, small look-up tables, and state storage within the FPGA fabric.
• I/O Capability  114 general-purpose I/O pins delivered for interfacing with sensors, actuators, peripherals, and external logic.
• Power  Operates from a specified core supply voltage range of 1.425 V to 1.575 V to match system power domains and regulator designs.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FPBGA, 17×17) for compact board-level integration.
• Industrial Reliability  Rated for industrial operation with an ambient range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant to support regulatory requirements for electronic assemblies.

Typical Applications

• Industrial control and automation  Use the device’s industrial temperature rating and 114 I/O for sensor interfacing, motor control logic, and machine I/O aggregation.
• Embedded system glue logic  Implement custom protocol bridging, timing control, and peripheral interfacing using the device’s logic elements and abundant I/O.
• Compact board-level FPGA integration  The 256-LBGA, surface-mount package supports space-constrained designs that require programmable logic in a small footprint.
• Prototyping and FPGA-based feature offload  Offload specific functions from a microcontroller or ASIC using the FPGA’s logic resources and on-chip memory for control or preprocessing tasks.

Unique Advantages

• Moderate logic density: 6,144 logic elements and 250,000 gates enable substantial custom logic implementation without excessive board-level complexity.
• Generous I/O count: 114 I/O pins accommodate multiple interfaces and parallel connections for flexible system integration.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in demanding ambient environments.
• Compact BGA footprint: 256-LBGA (256-FPBGA, 17×17) package provides a dense, surface-mount solution for space-sensitive applications.
• Defined low-voltage operation: Core supply range of 1.425 V to 1.575 V supports designs with controlled power domains and modern regulator architectures.
• RoHS compliant: Meets environmental compliance expectations for commercial and industrial electronics manufacturing.

Why Choose M1AFS250-1FGG256I?

The M1AFS250-1FGG256I positions itself as a practical, industrial-grade FPGA option when you need a moderate amount of programmable logic, substantial I/O, and a compact surface-mount package. Its combination of 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 114 I/O pins makes it suitable for embedded designs that require custom logic, protocol bridging, or I/O aggregation in industrial environments.

Manufactured by Microchip Technology and supplied in a 256-LBGA package with defined voltage and temperature ranges, this device serves designers seeking a reliable, RoHS-compliant FPGA for long-lived industrial deployments and space-constrained board layouts.

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