M1AFS250-2FG256

The M1AFS250-2FG256 is a Fusion® field programmable gate array from Microchip Technology, provided in a 256-LBGA package. It delivers a balanced combination of logic capacity, on-chip memory and I/O for commercial embedded designs.

With 6,144 logic elements, approximately 36.9 Kbits of embedded RAM and 114 I/O, this device is intended for applications that require moderate logic density, dedicated on-chip memory and a compact surface-mount footprint while operating within a commercial temperature range.

Key Features

• Logic Capacity 6,144 logic elements (equivalent cell count) supporting up to 250,000 gates for implementing custom digital functions.
• Embedded Memory Total on-chip RAM of 36,864 bits (≈36.9 Kbits) for small buffering, state storage and local data handling.
• I/O 114 device I/O pins to support multiple peripheral interfaces and board-level interconnects.
• Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount assembly suitable for compact board layouts.
• Power Nominal core supply range 1.425 V to 1.575 V to match FPGA core voltage requirements.
• Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement control logic, glue functions and protocol handling within devices that operate in commercial temperature ranges.
• I/O-rich interface modules — Use the 114 I/O pins to consolidate multiple board-level interfaces and simplify PCB routing.
• Compact FPGA board designs — Leverage the 256-LBGA (17×17) package and surface-mount mounting for space-constrained PCBs.

Unique Advantages

• Balanced logic and gate count — 6,144 logic elements and 250,000 gates provide a midpoint capacity suitable for a range of commercial digital functions without over-provisioning.
• On-chip RAM for local storage — 36,864 bits of embedded RAM enable local buffering and state retention without external memory.
• Generous I/O — 114 I/O pins allow integration of multiple peripherals and simplify system-level interfacing.
• Compact, manufacturable package — 256-LBGA (256-FPBGA, 17×17) surface-mount package supports compact board layouts and standard assembly processes.
• Commercial-grade operation — Rated for 0 °C to 85 °C, aligning with a wide range of commercial product requirements.
• RoHS compliant — Meets environmental compliance expectations for commercial electronics.

Why Choose M1AFS250-2FG256?

The M1AFS250-2FG256 positions itself as a Fusion® FPGA option for commercial designs that need a moderate amount of logic, integrated on-chip memory and a substantial number of I/O in a compact package. Its specification set—6,144 logic elements, 36,864 bits of RAM, 114 I/O and a 256-LBGA footprint—makes it suitable for board-level implementations where space and integration matter.

Manufactured by Microchip Technology and provided as a commercial-grade, RoHS-compliant device, the M1AFS250-2FG256 is appropriate for customers developing compact embedded systems that require reliable, on-chip resources and a defined operating voltage and temperature envelope.

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