M1A3PE3000L-FGG896I

The M1A3PE3000L-FGG896I is a ProASIC3L-series Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It provides a large logic capacity and high I/O density in a 896-ball BGA package suitable for surface-mount assembly.

Engineered for designs that require substantial on-chip logic, gate density and memory, this device delivers 75,264 logic elements and approximately 0.516 Mbits of embedded memory while operating across an industrial temperature range and a low-voltage supply window.

Key Features

• Logic Capacity  75,264 logic elements (cells) enabling complex digital designs and sizeable programmable logic blocks.
• Gate Count  Approximately 3,000,000 gates to support advanced combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data handling without immediate dependence on external memory.
• High I/O Count  620 user I/O pins to accommodate dense interfacing requirements with peripherals, sensors, and external logic.
• Power  Operates from a supply voltage range of 1.14 V to 1.575 V, suitable for low-voltage system domains.
• Package  896-ball FBGA package (896-FBGA, 31 × 31 mm) in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, meeting environmental needs for industrial deployments.
• Mounting  Surface mount device for standard PCB assembly processes.

Typical Applications

• Industrial Control Systems  Leverages industrial temperature rating, large logic element count, and high I/O density for control, monitoring, and automation functions.
• High‑I/O Interface and Aggregation  620 I/O pins enable aggregation and translation of multiple peripheral interfaces in compact systems.
• Embedded Processing and Glue Logic  Large logic capacity and on-chip RAM support complex glue logic, protocol handling, and custom state machines within embedded products.

Unique Advantages

• Substantial Logic Density: 75,264 logic elements provide headroom for complex designs and feature integration on a single device.
• Significant Gate Count: Approximately 3,000,000 gates to implement sophisticated digital functions and control logic.
• On‑Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for many design functions.
• High Pin Count for Flexible Integration: 620 I/O pins support extensive peripheral connectivity and board-level consolidation.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet thermal demands of industrial applications.
• Compact BGA Packaging: 896-FBGA (31 × 31 mm) surface-mount package balances I/O density and PCB area for space-constrained designs.

Why Choose M1A3PE3000L-FGG896I?

The M1A3PE3000L-FGG896I positions itself as a high-capacity, industrial-grade FPGA option for engineers needing extensive logic resources, substantial on-chip memory, and a very high I/O count in a compact BGA package. Its specified voltage range and temperature rating make it suitable for industrial embedded designs that demand predictable electrical and environmental performance.

This device is appropriate for development teams and product designs that require scalability of logic and I/O, consolidation of board-level functions, and a vendor-supported FPGA fabric for long-term production and maintenance.

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