M1A3PE3000-1PQG208

The M1A3PE3000-1PQG208 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology, supplied in a 208-BFQFP surface-mount package. It delivers a high-density programmable logic fabric with substantial embedded memory and I/O resources tailored for commercial embedded designs.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 147 I/O pins, this commercial-grade device is suitable for integration where programmable logic, moderate on-chip RAM and a compact 208-pin package are required. The device operates from a 1.425 V to 1.575 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  Provides 75,264 logic elements and approximately 3,000,000 gates to implement complex combinational and sequential logic functions on-chip.
• Embedded Memory  Contains 516,096 bits of on-chip RAM (approximately 0.516 Mbits) for buffering, FIFOs, and small data structures without external memory.
• I/O Resources  Offers 147 I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
• Power  Core supply range is 1.425 V to 1.575 V, enabling predictable power sequencing and design planning for the FPGA core.
• Package & Mounting  Supplied in a 208-BFQFP package (supplier device package: 208-PQFP, 28×28) optimized for surface-mount assembly.
• Operating Conditions  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Commercial embedded systems  Use the FPGA to implement custom logic, interface control and I/O management in space-constrained commercial products.
• Prototyping and development  Leverage the large logic capacity and on-chip RAM to prototype complex FPGA-based functions before final assimilation into a product design.
• Interface bridging  Implement protocol adapters, glue logic or custom peripherals using the plentiful I/O and programmable fabric.

Unique Advantages

• High-density programmable logic: 75,264 logic elements and 3,000,000 gates enable integration of significant logic functions on a single device, reducing external component count.
• On-chip memory resources: Approximately 0.516 Mbits of embedded RAM supports internal buffering and data handling without immediate need for external memory.
• Flexible I/O capacity: 147 I/O pins provide room for multiple interfaces and board-level signals in a single 208-pin package.
• Compact surface-mount package: The 208-BFQFP (28×28) package balances pin count and board area for compact commercial designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic applications.
• Standards-aware manufacturing: RoHS compliance supports modern assembly and environmental requirements.

Why Choose M1A3PE3000-1PQG208?

The M1A3PE3000-1PQG208 positions itself as a high-density, commercial-grade FPGA option from Microchip Technology that combines substantial logic capacity, embedded RAM and abundant I/O in a single 208-pin surface-mount package. Its core voltage range and commercial temperature rating make it well-suited for developers building commercial embedded products that require on-board programmable logic and memory.

This part is a practical choice for design teams needing a balance of logic density, on-chip memory and connectivity without moving to specialty grades. Its specifications support scalable integration of custom logic functions while maintaining compatibility with RoHS-compliant manufacturing processes.

Request a quote or submit an inquiry today to obtain pricing and availability for the M1A3PE3000-1PQG208.