M1A3PE3000-1FGG896I

The M1A3PE3000-1FGG896I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for high-density, industrial-grade digital designs. It integrates 75,264 logic elements and a substantial I/O complement to support complex system integration and high-pin-count interfacing.

With approximately 0.516 Mbits of embedded memory, 3,000,000 gates and a 620-pin I/O footprint in an 896-BGA package, this device targets applications that require robust logic capacity, extensive external connectivity and an industrial operating temperature range.

Key Features

• High-density logic  75,264 logic elements and 3,000,000 gates provide the fabric required for complex digital functions and parallel processing architectures.
• Embedded memory  Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for local buffering, state storage and small-data block operations.
• Extensive I/O  620 available I/Os accommodate wide parallel buses, multi-channel interfaces and high-pin-count system interconnects.
• Power supply range  Operates from 1.425 V to 1.575 V supply voltage to match system power domains and specifications.
• Industrial temperature rating  Qualified for operation from -40°C to 100°C, suitable for industrial environments and extended-temperature applications.
• Package and mounting  896-BGA package (supplier package: 896-FBGA, 31×31) in a surface-mount form factor for high-pin-count board designs.
• Regulatory compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Use the device for complex control logic, sensor aggregation and I/O-rich automation systems that require industrial temperature operation.
• Embedded systems and prototyping  High logic density and on-chip memory support rapid development of custom digital blocks and proof-of-concept systems.
• Communications and networking equipment  Large I/O count and dense logic capacity enable protocol bridging, packet handling and multi-channel interface implementations.

Unique Advantages

• High logic capacity: 75,264 logic elements and 3,000,000 gates provide headroom for sizable designs without immediate migration to larger devices.
• Large I/O footprint: 620 I/Os reduce the need for external multiplexing and simplify board-level routing for multi-interface systems.
• On-chip memory: Approximately 0.516 Mbits of embedded RAM supports local data buffering and reduces external memory dependencies.
• Industrial robustness: -40°C to 100°C operating range meets the demands of industrial deployments and extended-environment systems.
• Compact, high-pin-count package: 896-BGA (896-FBGA, 31×31) enables dense board integration while providing the required pin count for complex designs.
• Regulatory alignment: RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose M1A3PE3000-1FGG896I?

The M1A3PE3000-1FGG896I combines substantial logic capacity, significant embedded memory and one of the largest I/O complements available in an industrial-grade FPGA package. It is well suited for engineers and procurement teams building systems that demand dense digital integration, broad external connectivity and reliable operation across extended temperature ranges.

From industrial control to communications hardware and advanced embedded prototypes, this Microchip Technology ProASIC3E device delivers the key building blocks—logic elements, on-chip RAM, and high I/O count—required to implement complex, I/O-rich designs while maintaining board-level efficiency in an 896-BGA surface-mount package.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3PE3000-1FGG896I and to discuss how it can fit into your next high-density, industrial FPGA design.