M1A3PE3000-1FGG324I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 221 516096 324-BGA |
|---|---|
| Quantity | 1,121 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 221 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of M1A3PE3000-1FGG324I – ProASIC3E FPGA, 75,264 Logic Elements, 221 I/O
The M1A3PE3000-1FGG324I is a ProASIC3E field programmable gate array (FPGA) IC designed for industrial applications. It integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory, offering a high level of on-chip integration in a compact 324-FBGA (19×19) package.
With 3,000,000 gates and 221 I/O pins, this surface-mount FPGA provides designers with substantial logic capacity and I/O density while operating from a 1.425 V to 1.575 V supply and across an industrial temperature range of -40 °C to 100 °C.
Key Features
- Core Logic 75,264 logic elements and 3,000,000 gates provide significant programmable logic capacity for complex designs.
- Embedded Memory Approximately 0.516 Mbits of on-chip RAM for implementing FIFOs, buffers, and other memory-backed logic functions.
- I/O Density 221 I/O pins support a wide range of external interfaces and system connections in a single device.
- Supply Voltage Nominal operating voltage range of 1.425 V to 1.575 V to match system power architectures requiring this supply domain.
- Package & Mounting Available in a 324-BGA / 324-FBGA (19×19) package and intended for surface-mount assembly to save board area.
- Temperature & Grade Industrial-grade device rated for operation from -40 °C to 100 °C for use in temperature-demanding environments.
- Environmental Compliance RoHS compliant to support environmental and regulatory requirements.
Unique Advantages
- High integration: Combines 75,264 logic elements, 3,000,000 gates and on-chip memory to reduce external component count and simplify board design.
- Robust I/O capability: 221 I/Os enable connectivity to numerous peripherals and interfaces without multiple devices.
- Industrial temperature rating: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Compact BGA footprint: 324-FBGA (19×19) package provides a space-efficient solution for high-density PCB layouts.
- Controlled supply domain: Defined 1.425 V to 1.575 V supply range facilitates predictable power design and system integration.
- Regulatory readiness: RoHS compliance helps meet environmental management and procurement requirements.
Why Choose M1A3PE3000-1FGG324I?
The M1A3PE3000-1FGG324I positions itself as a high-capacity, industrial-grade FPGA that balances substantial programmable logic, embedded memory, and a dense I/O complement within a compact BGA package. Its defined supply voltage and wide operating temperature range make it suitable for designs requiring reliable, integrated programmable logic in challenging environments.
This device is well suited for engineering teams seeking a scalable FPGA option that consolidates logic and memory resources, reduces board-level BOM, and supports deployment across temperature-critical applications while meeting RoHS requirements.
Request a quote or submit an inquiry to get pricing, availability, and further technical support for the M1A3PE3000-1FGG324I.

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