M1A3PE3000-1FGG324

The M1A3PE3000-1FGG324 is a ProASIC3E field programmable gate array (FPGA) supplied in a 324-BGA package. It provides a balance of logic density, embedded memory and I/O for commercial-grade embedded designs.

With approximately 75,264 logic elements, roughly 0.516 Mbits of embedded memory, 221 user I/Os and a 1.425 V–1.575 V core supply range, this device targets applications that require substantial on-chip logic and memory in a compact surface-mount FPGA package.

Key Features

• Core Logic – Approximately 75,264 logic elements and 3,000,000 gates provide high functional density for complex digital designs.
• Embedded Memory – Total on-chip RAM of 516,096 bits (approximately 0.516 Mbits) to support data buffering and local storage.
• I/O Capacity – 221 user I/Os to support wide-ranging peripheral and bus interfacing needs.
• Power – Core voltage supply specified from 1.425 V to 1.575 V for predictable power design and supply selection.
• Package & Mounting – Supplied in a 324-BGA (supplier device package 324-FBGA, 19×19) and designed for surface-mount placement to save board area.
• Operating Range & Grade – Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance – RoHS compliant, supporting regulatory and manufacturing requirements.

Typical Applications

• Embedded Control & Custom Logic – Use the device where large numbers of combinational and sequential logic elements are required for application-specific processing and control.
• High-Density I/O Interfacing – Ideal for systems that need extensive external connectivity, leveraging 221 available I/Os for sensor, peripheral or bus connections.
• On-Chip Data Buffering – Built-in RAM (approximately 0.516 Mbits) supports local data storage for buffering, state machines and temporary data handling.
• Compact Board Designs – The 324-BGA surface-mount package suits space-constrained PCBs that need significant logic and memory within a small footprint.

Unique Advantages

• High Logic Density: Approximately 75,264 logic elements and 3,000,000 gates enable integration of complex functions into a single device, reducing BOM count.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM provides local storage to improve data throughput and lower external memory needs.
• Extensive I/O Count: 221 user I/Os give designers flexibility to connect multiple peripherals and interfaces without additional IO expanders.
• Compact BGA Footprint: The 324-FBGA (19×19) package supports dense board layouts while maintaining robust connectivity and signal routing options.
• Low-Voltage Core Operation: 1.425 V–1.575 V supply range supports modern low-voltage power domains and predictable power budgeting.
• Regulatory Compliance: RoHS compliance simplifies integration into products targeting compliant manufacturing processes.

Why Choose M1A3PE3000-1FGG324?

This ProASIC3E FPGA delivers a combination of substantial logic resources, embedded memory and a large number of I/Os in a compact 324-BGA surface-mount package. It is positioned for commercial-grade designs that need significant on-chip capability while maintaining predictable power and thermal limits across a 0 °C to 85 °C operating range.

Designers seeking to consolidate complex digital functions, reduce external components, and maintain a small PCB footprint will find the M1A3PE3000-1FGG324 suitable for advanced embedded applications where integration, I/O capacity and regulatory compliance are priorities.

Request a quote or contact sales to discuss availability, pricing and delivery for the M1A3PE3000-1FGG324.