M1A3PE3000-1FG484

The M1A3PE3000-1FG484 is a commercial-grade ProASIC3E field programmable gate array from Microchip Technology. It provides a high logic capacity and extensive I/O in a compact 484-ball BGA footprint for surface-mount applications.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory, and support for up to 341 I/O, this device targets designs that require significant on-chip logic and dense external connectivity while operating within a 1.425 V to 1.575 V supply range and a 0°C to 85°C temperature window.

Key Features

• Core Logic  Contains 75,264 logic elements and approximately 3,000,000 gates to implement complex programmable logic functions.
• Embedded Memory  Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, temporary storage, and logic state retention.
• I/O Density  Up to 341 general-purpose I/O pins to support high pin-count interfaces and multiple external connections.
• Power  Designed for a core supply voltage range of 1.425 V to 1.575 V to match system-level power requirements.
• Package & Mounting  484-ball FPBGA package (484-FPBGA, 23×23) in a surface-mount form factor for space-efficient PCB integration.
• Operating Range  Commercial grade operation across 0°C to 85°C for general-purpose embedded applications.
• Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• High-density I/O systems  Designs requiring a large number of external interfaces can take advantage of the device’s 341 I/O pins for connectivity and signal routing.
• Logic-intensive designs  Applications that need substantial programmable logic can use the 75,264 logic elements and 3,000,000-gate capacity to implement custom datapaths and control logic.
• On-chip buffering and state storage  Embedded projects needing modest on-chip RAM can utilize approximately 0.52 Mbits of memory for buffering and temporary storage.
• Compact surface-mount assemblies  The 484-FPBGA (23×23) package supports space-constrained PCBs while maintaining a high pin count for complex systems.

Unique Advantages

• High logic capacity: 75,264 logic elements enable implementation of complex algorithms and control functions on a single device, reducing component count.
• Substantial gate count: Approximately 3,000,000 gates provide the raw silicon resources for large-scale programmable logic integration.
• Extensive I/O: 341 I/O pins support multiple external buses, sensors, and peripherals without external multiplexing.
• Compact BGA packaging: 484-ball FPBGA (23×23) allows dense placement on modern PCBs while maintaining robust electrical connections.
• Commercial operating range: Rated for 0°C to 85°C, making it suitable for a wide range of general-purpose embedded environments.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose M1A3PE3000-1FG484?

The M1A3PE3000-1FG484 delivers a balance of high logic density, abundant I/O, and a compact surface-mount BGA package, positioning it for commercial embedded designs that require significant programmable logic and connectivity. Its defined supply voltage range and commercial temperature rating make it suitable for standard industrial and consumer applications where commercial-grade components are specified.

Backed by Microchip Technology, this ProASIC3E device provides a verifiable hardware platform for designs that prioritize integration and on-board programmable resources, helping reduce BOM complexity and consolidate functions onto a single FPGA device.

Request a quote or contact sales to discuss availability, pricing, and how the M1A3PE3000-1FG484 can meet your design requirements.