M1A3PE3000-1FG896I

The M1A3PE3000-1FG896I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It integrates a high logic density with on-chip memory and a large I/O count to support complex programmable logic designs.

Targeted for industrial applications, the device provides a combination of logic capacity, embedded memory and a high pin-count package, along with RoHS compliance and a wide operating temperature range.

Key Features

• Logic Capacity — 75,264 logic elements (LEs) and approximately 3,000,000 gates provide substantial resources for custom logic implementation.
• Embedded Memory — Approximately 0.52 Mbits of on-chip RAM (516,096 bits) for buffering, state storage and local data handling.
• I/O Density — 620 I/O pins enable extensive interfacing and signal routing options for complex systems.
• Package — 896-ball BGA package; supplier device package listed as 896-FBGA (31×31) to accommodate high-pin-count designs in a compact footprint.
• Power — Core voltage supply range of 1.425 V to 1.575 V allows precise power planning for the programmable core.
• Mounting and Grade — Surface mount device with Industrial grade designation for equipment requiring extended environmental tolerance.
• Operating Temperature — Rated for −40°C to 100°C to support a wide range of ambient conditions.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Automation — Implement control logic, custom interfaces and signal processing using the device's large logic element count and extensive I/O.
• Communications and Networking — Use the high I/O density and embedded memory for protocol handling, data buffering and interface bridging.
• Embedded System Integration — Consolidate multiple glue-logic functions and custom peripherals into a single FPGA package to streamline board-level design.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates let you implement large-scale custom logic without adding external ASICs or CPLDs.
• Large I/O Count: 620 I/Os provide flexible connection options for sensors, buses and peripheral interfaces, reducing the need for external multiplexing.
• On-chip Memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state retention, simplifying external memory requirements.
• Industry-Grade Thermal Range: −40°C to 100°C rating supports deployment in demanding ambient conditions common in industrial environments.
• Compact High-Pin Package: 896-BGA / 896-FBGA (31×31) provides a high pin count in a compact surface-mount form factor for dense PCB layouts.
• Regulatory Compliance: RoHS compliance aids in meeting environmental and manufacturing requirements.

Why Choose M1A3PE3000-1FG896I?

The M1A3PE3000-1FG896I combines substantial logic resources, embedded memory and a high I/O count in a single industrial-grade FPGA package. Its voltage and thermal ratings, along with RoHS compliance, make it suitable for designs that require stable operation across a wide range of conditions.

This device is well suited for engineers and system designers who need to consolidate complex logic, implement high-density interfaces and maintain robust operation in industrial environments, while leveraging Microchip Technology's ProASIC3E family capabilities.

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