M1A3PE3000-1FGG896

The M1A3PE3000-1FGG896 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density programmable fabric with 75,264 logic elements and approximately 0.516 Mbits of embedded memory, targeted for commercial-grade applications.

With up to 3,000,000 gates, 620 I/Os and an 896-FBGA package, this device is intended for designs that require substantial logic capacity and high I/O density within a surface-mount board footprint.

Key Features

• Logic Capacity  Provides 75,264 logic elements, enabling complex programmable logic implementations within a single device.
• Gate Count  Approximately 3,000,000 gates to support dense logic and control functions.
• Embedded Memory  Includes approximately 0.516 Mbits of on-chip RAM for state storage, buffering and small on-chip data structures.
• I/O Density  Up to 620 I/O pins to support extensive peripheral connectivity and parallel interfaces.
• Power Supply  Operates from a core supply range of 1.425 V to 1.575 V, suitable for controlled power-rail designs.
• Package & Mounting  Supplied in an 896-FBGA package (896-BGA, 31 × 31) for surface-mount PCB assembly and compact board integration.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environments.
• Compliance  RoHS compliant for restricted-substance conformity in commercial electronics production.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol handling or glue-logic where high logic density and on-chip memory are required.
• High-Density I/O Systems  Leverage 620 I/Os for multi-channel interfaces, board-level bridging or parallel data paths.
• Memory-Dependent Logic  Use the on-chip RAM for buffering, small FIFOs or state machines in data-path and control applications.
• Compact Board Integration  The 896-FBGA surface-mount package supports compact PCB layouts for space-constrained commercial products.

Unique Advantages

• Substantial Logic Scale: High logic-element count (75,264) and ~3,000,000 gates enable integration of large, consolidated functions onto a single FPGA.
• Significant I/O Capability: 620 I/Os provide flexibility for extensive external connectivity without external multiplexing.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces reliance on external memory for small to moderate buffering needs.
• Compact, Surface-Mount Package: The 896-FBGA (896-BGA, 31 × 31) supports dense PCB implementations while maintaining high pin count.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliance for commercial product deployment.

Why Choose M1A3PE3000-1FGG896?

The M1A3PE3000-1FGG896 balances high logic capacity, substantial I/O resources and embedded memory in a single ProASIC3E FPGA package from Microchip Technology. Its specifications make it well suited for commercial designs that require consolidated programmable logic, broad external connectivity and compact board-level integration.

For designers targeting commercial applications that need a high-density FPGA with clear electrical and thermal limits, this device offers a verifiable combination of resources and package form factor to support mid- to high-complexity logic implementations.

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