M1A3PE1500-PQ208
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 825 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-PQ208 – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 I/Os 276480‑bit RAM 208‑BFQFP
The M1A3PE1500-PQ208 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology in a 208‑lead BFQFP package. It provides a mid‑range logic fabric with a substantial number of logic elements and on‑chip memory for commercial embedded applications that require flexible I/O and compact surface‑mount packaging. Key attributes include 38,400 logic elements, approximately 0.276 Mbits of embedded RAM, 147 I/O pins, and a defined commercial operating temperature range.
Key Features
- Core / Logic 38,400 logic elements (LEs) supporting a total of 1,500,000 gates, enabling medium-complexity digital designs.
- Embedded Memory Approximately 0.276 Mbits of on‑chip RAM (276,480 bits) for data buffering, state storage, and small lookup tables.
- I/O Capacity 147 general-purpose I/O pins suitable for interfacing with peripherals, sensors, and external logic.
- Power Supply Single-core supply range: 1.425 V to 1.575 V to match system power rails and design requirements.
- Package & Mounting 208‑lead BFQFP (supplier device package: 208‑PQFP 28×28) in a surface‑mount form factor for compact board-level integration.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant construction for regulatory compliance in commercial products.
Typical Applications
- Commercial Embedded Systems — Use as the programmable logic core for control, glue logic, and custom peripheral interfacing in compact commercial devices.
- Communications Equipment — Implement protocol handling, data framing, or I/O aggregation where moderate logic capacity and numerous I/Os are required.
- Test & Measurement — Integrate signal conditioning control, data capture coordination, and custom timing logic leveraging on‑chip RAM and abundant I/Os.
- Prototyping & Development — Rapidly validate custom logic and system partitioning in a surface‑mount FPGA well suited to prototype and production PCB layouts.
Unique Advantages
- Substantial Logic Resources: 38,400 logic elements and 1,500,000 gates provide the capacity to implement moderately complex digital functions without external PLD devices.
- On‑Chip Memory for Local Data: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small buffers and LUTs, simplifying board design.
- High I/O Count: 147 I/Os enable direct connections to multiple peripherals and interfaces, minimizing additional interface components.
- Compact Surface‑Mount Package: 208‑lead BFQFP (28×28 PQFP) offers a space-efficient footprint for dense board layouts while supporting reliable solder mounting.
- Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS‑compliant, suitable for commercial product deployments where those constraints apply.
- Defined Core Voltage Range: Operates from 1.425 V to 1.575 V, allowing predictable integration with compatible supply rails.
Why Choose M1A3PE1500-PQ208?
The M1A3PE1500-PQ208 positions itself as a versatile, commercially graded FPGA option for designers who need a balanced combination of logic capacity, embedded RAM, and a high I/O count in a compact surface‑mount package. Its 38,400 logic elements and approximately 0.276 Mbits of on‑chip memory make it suitable for mid‑complexity digital designs where board space and I/O density matter.
This device is appropriate for engineering teams building commercial embedded systems, communications modules, or test equipment prototypes that require reliable, repeatable FPGA resources and clear electrical and thermal operating ranges from a known manufacturer, Microchip Technology.
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