M1A3PE1500-FGG484

The M1A3PE1500-FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It provides a balance of logic capacity, on-chip memory, and a high I/O count in a compact 484-ball BGA package for space-constrained boards.

Targeted at commercial electronic designs, this device is suitable where moderate logic density, multiple I/O, and controlled power rails are required within a standard 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 38,400 logic elements delivering approximately 1,500,000 gates for implementing medium-complexity digital designs.
• On‑chip Memory — Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) to support buffers, FIFOs, and local storage.
• I/O Density — Up to 280 user I/O pins, enabling extensive peripheral interfacing and board-level connectivity.
• Package & Mounting — 484-ball FBGA (484-FPBGA) in a 23×23 mm footprint; surface-mount package suitable for compact PCB layouts.
• Power — Core supply voltage range of 1.425 V to 1.575 V for predictable power design and integration with regulated rails.
• Operating Conditions & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant for environmentally conscious production and procurement.

Typical Applications

• Consumer Electronics — Implement control logic and peripheral interfaces in consumer devices using the device’s 38,400 logic elements and 280 I/O.
• Communications Equipment — Support protocol bridging, I/O aggregation, and timing functions where moderate on‑chip RAM and high I/O count are required.
• Instrumentation & Test — Enable custom measurement logic, data buffering, and signal routing in benchtop and portable test equipment.
• Prototyping & Development — Rapidly evaluate digital architectures and validate system-level designs with a commercially graded FPGA offering.

Unique Advantages

• High Integration Density: 38,400 logic elements and approximately 1,500,000 gates enable substantial logic integration while minimizing external components.
• Compact, High‑Pin Package: 484-ball FBGA (23×23 mm) provides a high I/O count in a small board footprint for space-constrained applications.
• On‑Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks.
• Controlled Core Voltage: Narrow supply range (1.425 V–1.575 V) simplifies power-supply design for consistent device performance.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for global electronic products.

Why Choose M1A3PE1500-FGG484?

The M1A3PE1500-FGG484 delivers a balanced combination of logic resources, embedded memory, and a high I/O count in a compact 484-BGA package from Microchip Technology. It is well suited for commercial embedded systems that require moderate logic density and extensive peripheral interfacing without large board area penalties.

Choosing this FPGA supports designs that benefit from high integration and RoHS compliance while operating within standard commercial temperature and power constraints. It is a practical option for engineers seeking predictable device specifications for production deployments.

If you would like pricing, availability, or to request a quote for the M1A3PE1500-FGG484, please submit an inquiry or request a quote today.