M1A3PE1500-FG676

The M1A3PE1500-FG676 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It delivers a large logic capacity with 1,500,000 gates and 38,400 logic elements to support complex, high‑density digital designs.

With 444 user I/O, approximately 0.276 Mbits of on‑chip RAM, a compact 676‑FBGA (27×27) package, and a tight core supply range of 1.425 V to 1.575 V, this device is targeted at commercial applications requiring significant logic and I/O integration within a surface‑mount BGA footprint.

Key Features

• Logic Capacity — 38,400 logic elements (cells) providing a total of 1,500,000 gates for implementing complex digital functions.
• Embedded Memory — Total RAM of 276,480 bits, approximately 0.276 Mbits of on‑chip memory for buffering, state storage, and small lookup tables.
• High I/O Count — 444 user I/O pins to support wide interfaces, multi‑channel connectivity, and parallel data paths.
• Package and Mounting — Supplied in a 676‑FBGA (27×27) package case (676‑BGA) optimized for surface‑mount assembly and compact board layouts.
• Power — Core supply range from 1.425 V to 1.575 V, enabling controlled power budgeting in system designs.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High‑density digital systems — Implement large combinational and sequential logic blocks using the device’s 38,400 logic elements and 1,500,000 gates.
• Multi‑channel I/O interfaces — Leverage 444 I/O pins for parallel data capture, wide buses, or multiple peripheral connections.
• On‑board buffering and small memory tasks — Use the approximately 0.276 Mbits of embedded RAM for FIFOs, small data tables, and temporary storage.

Unique Advantages

• Substantial logic density: 38,400 logic elements and 1,500,000 gates enable consolidation of complex functions into a single device, reducing board-level component count.
• Large I/O availability: 444 I/O pins allow flexible routing for dense connectivity requirements, minimizing the need for external multiplexers or expanders.
• Compact BGA package: The 676‑FBGA (27×27) package supports high pin counts in a compact surface‑mount form factor suitable for space‑constrained PCBs.
• Controlled power envelope: A defined core supply window (1.425 V to 1.575 V) helps streamline power‑supply design and regulation choices.
• Commercial temperature rating: Rated 0 °C to 85 °C for a wide range of general‑purpose electronic systems.
• RoHS compliant: Meets common lead‑free manufacturing requirements for global production.

Why Choose M1A3PE1500-FG676?

The M1A3PE1500-FG676 brings a combination of high logic capacity, extensive I/O, and on‑chip memory in a compact 676‑FBGA surface‑mount package. It suits commercial designs that need to integrate substantial digital functionality and numerous interfaces while managing board space and component count.

Backed by Microchip Technology, this ProASIC3E device provides a clear specification set—logic resources, I/O density, power range, package, and operating temperature—that helps engineering and procurement teams evaluate fit and long‑term value for complex embedded designs.

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