M1A3PE1500-FG484I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 280 276480 484-BGA |
|---|---|
| Quantity | 333 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 280 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-FG484I – ProASIC3E Field Programmable Gate Array (FPGA) IC 280 276480 484-BGA
The M1A3PE1500-FG484I is a ProASIC3E field programmable gate array by Microchip Technology optimized for industrial embedded applications. It delivers a balance of programmable logic capacity, I/O density and on-chip memory suitable for complex control, glue-logic and interface functions in systems that require an industrial temperature range and a 1.5 V core supply.
Key on-chip resources include approximately 38,400 logic elements, roughly 0.276 Mbits of embedded memory, 1,500,000 gates and 280 I/O pins, packaged in a 484-ball FPBGA (23×23) surface-mount package and certified RoHS compliant.
Key Features
- Logic Capacity Approximately 38,400 logic elements and 1,500,000 gates provide sufficient combinational and sequential resources for mid-density FPGA designs.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM for buffering, small FIFOs and control-state storage.
- I/O Density 280 user I/O pins support complex peripheral interfacing and multi-channel signal routing in a single device.
- Package and Mounting 484-ball FPBGA (23×23) surface-mount package (484-BGA) provides a compact, high-pin-count footprint for board-level integration.
- Power Supply Requires a core supply in the range of 1.425 V to 1.575 V, allowing integration into systems using a nominal 1.5 V core rail.
- Industrial Temperature Rating Rated for operation from −40 °C to 100 °C, suitable for many industrial environments.
- Compliance RoHS compliant to meet environmental and manufacturing requirements.
Typical Applications
- Industrial Control and Automation Use the device for programmable control logic, I/O aggregation and protocol bridging where an industrial temperature range is required.
- Embedded Systems Integrate as on-board programmable logic for system glue, custom peripherals and timing-critical sequencing using available logic and on-chip RAM.
- I/O-Intensive Interfaces Deploy in designs that require many external connections—280 I/Os enable dense sensor, actuator and bus interfacing.
Unique Advantages
- Balanced Logic and Memory Combines approximately 38,400 logic elements with on-chip memory for efficient implementation of control and buffering functions without external RAM.
- High I/O Count 280 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-channel designs.
- Industrial-Grade Operation Specified −40 °C to 100 °C operation enables deployment in demanding environments where extended temperature ranges are required.
- Compact High-Pin-Count Package The 484-FPBGA (23×23) package provides high pin density in a compact surface-mount form factor for space-constrained PCBs.
- Predictable Core Supply A defined 1.425 V to 1.575 V supply range simplifies power design for systems standardized on a 1.5 V core rail.
- Manufacturer Backing Produced by Microchip Technology, providing traceability to a major component supplier.
Why Choose M1A3PE1500-FG484I?
The M1A3PE1500-FG484I is positioned for designers who need a mid-density FPGA with a strong combination of logic elements, I/O capacity and on-chip memory in an industrial-grade package. Its 1.5 V core supply requirement, wide operating temperature range and 484-ball FPBGA package make it a practical choice for embedded and industrial applications that demand reliable, reconfigurable logic in a compact footprint.
With RoHS compliance and a clear set of on-chip resources—approximately 38,400 logic elements, ~0.276 Mbits embedded memory, 280 I/Os and 1,500,000 gates—this device fits designs that require substantial I/O and programmable logic without excessive external components.
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