M1A3PE1500-2FGG676

The M1A3PE1500-2FGG676 is a commercial-grade ProASIC3E Field Programmable Gate Array (FPGA) IC designed for programmable logic integration in cost-sensitive, commercial systems. It combines a large logic fabric, significant on-chip memory, and high I/O density in a 676-ball FBGA package to support complex system integration and flexible hardware acceleration.

Key Features

• Logic Capacity  38,400 logic elements provide a versatile fabric for implementing custom digital functions and subsystem integration.
• On-Chip Memory  Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) for buffering, state storage, and small data structures.
• I/O Density  444 available I/O pins support dense external interfacing for peripherals, buses, and signal routing.
• Gate Count  1,500,000 logical gates for capacity planning and mapping complex designs.
• Power Supply  Operates from a core voltage supply range of 1.425 V to 1.575 V for system power planning.
• Package & Mounting  676-FBGA (27×27) supplier device package in a surface-mount form factor for compact PCB integration.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C suitable for standard commercial deployments.
• Regulatory Compliance  RoHS compliant to support lead-free manufacturing and environmental requirements.

Typical Applications

• Custom Logic and Acceleration  Use the 38,400 logic elements and 1,500,000 gates to implement application-specific accelerators and protocol engines.
• High‑Density I/O Systems  The 444 I/O pins enable interfacing to multiple peripherals, sensors, and high-pin-count connectors on compact boards.
• Embedded Memory Buffering  Approximately 0.276 Mbits of on-chip RAM supports packet buffering, small FIFOs, and local data storage.
• Compact, Surface-Mount Designs  The 676-FBGA (27×27) package provides a high-pin-count, space-efficient option for constrained PCB layouts.

Unique Advantages

• High Logic Integration: 38,400 logic elements allow significant functionality to be consolidated on a single device, reducing external component count.
• Substantial Gate Capacity: 1,500,000 gates provide headroom for complex state machines, datapaths, and control logic without immediate device migration.
• Dense External Connectivity: 444 I/O pins enable flexible interfacing to a wide range of sensors, memory, and communication endpoints.
• Compact Packaging: The 676-FBGA (27×27) surface-mount package delivers high pin count in a compact footprint for space-constrained designs.
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation to meet the needs of standard commercial applications.
• Regulatory Readiness: RoHS compliance simplifies integration into lead-free manufacturing flows.

Why Choose M1A3PE1500-2FGG676?

The M1A3PE1500-2FGG676 positions itself as a commercially graded FPGA that balances logic capacity, on-chip memory, and extensive I/O in a compact FBGA package. Its combination of 38,400 logic elements, roughly 0.276 Mbits of embedded memory, and 444 I/Os makes it suitable for designers seeking to consolidate functionality, accelerate custom logic, and implement dense interfaces without large external BOM changes.

This part is well suited to engineers and procurement teams targeting commercial embedded systems that require robust programmable logic, predictable operating conditions, and RoHS-compliant components. Its package and electrical characteristics support efficient board-level integration while providing the scalability needed for evolving designs.

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