M1A3PE1500-2FG676

The M1A3PE1500-2FG676 is a ProASIC3E Flash-based FPGA IC from Microchip Technology. It integrates 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory to support complex programmable logic designs.

Designed as a surface-mount device in a 676-ball BGA (676-FBGA, 27×27) package, this commercial-grade FPGA provides up to 444 user I/Os and operates from a 1.425 V to 1.575 V supply over a 0 °C to 85 °C temperature range. The device is RoHS compliant.

Key Features

• Core Logic: 1,500,000 gates and 38,400 logic elements provide substantial programmable logic capacity for mid- to high-density designs.
• On-chip Memory: Approximately 0.276 Mbits of embedded RAM to support local buffering, state storage and small data arrays.
• I/O Capability: Up to 444 user I/Os to interface with a wide range of peripherals and system signals.
• Package & Mounting: 676-ball BGA (676-FBGA, 27×27) in a surface-mount form factor to enable compact board integration.
• Power: Specified supply range of 1.425 V to 1.575 V for core operation.
• Operating Range & Grade: Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• System Integration and I/O Expansion: Use where large I/O counts and programmable logic are required to consolidate glue logic and interface functions.
• Embedded Logic Acceleration: Implement custom datapaths or control logic leveraging 38,400 logic elements and on-chip RAM for local buffering.
• Prototyping and Development Platforms: Suitable for development boards and evaluation systems that require significant gate density and flexible I/O routing.

Unique Advantages

• High Logic Density: 1,500,000 gates and 38,400 logic elements provide capacity for complex designs without immediate need for external logic.
• Generous I/O Count: Up to 444 user I/Os simplifies board-level routing and peripheral connectivity, reducing the need for external expanders.
• Compact BGA Package: 676-FBGA (27×27) enables high pin count in a compact footprint for space-constrained PCB layouts.
• Controlled Power Envelope: Narrow core supply range (1.425 V–1.575 V) supports predictable power design and regulation choices.
• Commercial Availability: Commercial-grade rating and RoHS compliance support mainstream electronics and embedded system applications.

Why Choose M1A3PE1500-2FG676?

The M1A3PE1500-2FG676 balances substantial programmable logic capacity, a high I/O count and a compact 676-FBGA package for designs that require dense integration of custom logic and interfaces. Its combination of 1,500,000 gates, 38,400 logic elements and embedded RAM makes it well suited for mid- to high-complexity FPGA implementations within commercial temperature ranges.

For engineering teams seeking a RoHS-compliant ProASIC3E device that simplifies board-level integration while providing significant on-chip resources, this part offers a clear, specification-driven choice backed by Microchip Technology.

Request a quote or submit a sales inquiry to receive pricing and availability for M1A3PE1500-2FG676 and to discuss how this FPGA can fit your next design.