M1A3PE1500-1PQG208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 1,083 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-1PQG208I – ProASIC3E FPGA, 147 I/O, approximately 0.276 Mbits RAM, 208-BFQFP
The M1A3PE1500-1PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology, supplied in a 208-BFQFP surface-mount package. It delivers a sizable programmable fabric—38,400 logic elements—and a moderate amount of embedded memory, targeted for industrial applications that require configurable logic, deterministic I/O and robust operating ranges.
Key Features
- Logic Capacity Contains 38,400 logic elements providing programmable resources to implement complex digital functions and custom logic blocks.
- Gate Count Approximately 1.5 million gates to support large-scale combinational and sequential logic designs.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, state storage and small data tables.
- I/O Resources 147 general-purpose I/O pins to interface with sensors, peripherals and external logic.
- Power Core supply range of 1.425 V to 1.575 V to align with low-voltage system domains.
- Package & Mounting 208-BFQFP (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for PCB assembly and compact system integration.
- Operating Range Industrial-grade operation from -40°C to 100°C for deployment in demanding environments.
- Regulatory RoHS compliant to meet lead-free assembly and environmental requirements.
Typical Applications
- Industrial Control Use the 38,400 logic elements and 147 I/O to implement control algorithms, sensor interfaces and I/O aggregation in industrial automation systems.
- Communications & Networking Deploy as protocol bridges, packet-processing accelerators or interface logic where medium-density logic and multiple I/O are required.
- Test & Measurement Leverage on-chip RAM and abundant logic resources for timing-critical data capture, custom signal processing and instrument control.
Unique Advantages
- Highly configurable logic fabric: 38,400 logic elements enable designers to implement complex, custom digital functions without discrete CPLD or ASIC redesigns.
- Moderate embedded memory: Approximately 0.276 Mbits of on-chip RAM support buffering and state retention for many control and processing tasks, reducing the need for external memory in compact designs.
- Generous I/O count: 147 I/O pins simplify board-level integration by accommodating multiple peripherals and interfaces directly.
- Industrial temperature rating: -40°C to 100°C operation supports deployment in challenging environments common to industrial systems.
- Compact surface-mount package: 208-BFQFP (28×28 PQFP footprint) balances pin density and board-space considerations for medium-complexity assemblies.
- Vendor backing: Supplied by Microchip Technology and offered with documented specifications to support design validation and lifecycle planning.
Why Choose M1A3PE1500-1PQG208I?
The M1A3PE1500-1PQG208I positions itself as a robust, industrial-grade FPGA option for mid-to-high complexity digital designs. With 38,400 logic elements, approximately 0.276 Mbits of embedded RAM and 147 I/O, it provides the resources needed to consolidate interfaces, offload processing tasks and implement custom control logic in space-constrained assemblies.
Backed by Microchip Technology and delivered in a 208-BFQFP surface-mount package, this device is suited to engineering teams seeking a configurable, industrial-rated FPGA building block that balances logic capacity, I/O density and a well-defined operating envelope for long-term system deployments.
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