M1A3PE1500-2FG676I

The M1A3PE1500-2FG676I is a ProASIC3E flash-based FPGA designed for industrial applications requiring significant logic capacity and high I/O density. It combines 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory to implement complex custom logic, buffering and glue-logic functions.

With 444 user I/O, a compact 676-FBGA (27×27) package and an industrial operating range from −40 °C to 100 °C, this device is suited for systems that demand a balance of integration, I/O count and robustness within a defined VCC supply window.

Key Features

• Core density — 1,500,000 gates and 38,400 logic elements provide substantial programmable logic capacity for complex control and signal-processing functions.
• Embedded memory — Approximately 0.276 Mbits of on-chip RAM to support buffering, small lookup tables and state storage without external memory.
• I/O capability — 444 user I/O pins to support dense peripheral interfacing and multi-channel signal aggregation.
• Power supply — Operates from a defined supply range of 1.425 V to 1.575 V for predictable power design and rail planning.
• Package and mounting — Available in a 676-FBGA (27×27) package and intended for surface-mount assembly to save board area in compact systems.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS compliant — Meets RoHS requirements for restricted substances.

Typical Applications

• Industrial control — Implement control logic, protocol bridging and I/O aggregation where industrial temperature range and high I/O count are required.
• Communications infrastructure — Use the device’s logic density and plentiful I/O for packet processing, custom protocol handling or interface conversion.
• Test and measurement — Deploy for data capture, preprocessing and timing-critical logic in compact, surface-mount instrument designs.

Unique Advantages

• High logic capacity: 1,500,000 gates and 38,400 logic elements enable large-scale custom logic implementations without external PLDs.
• Dense I/O integration: 444 user I/Os reduce the need for additional interface components and simplify board-level routing for multi-signal designs.
• Compact packaging: 676-FBGA (27×27) provides a small footprint for high-density applications while supporting surface-mount assembly.
• Industrial robustness: Rated operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Predictable power domain: Narrow supply range (1.425 V–1.575 V) aids in power-supply design and margin planning.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and end-product compliance.

Why Choose M1A3PE1500-2FG676I?

The M1A3PE1500-2FG676I balances significant programmable logic capacity, abundant I/O and a compact BGA footprint for designs that require high integration in industrial conditions. Its combination of gates, logic elements and embedded RAM lets engineers consolidate functions that would otherwise require multiple discrete components.

Because it is offered in an industrial temperature grade and RoHS-compliant package, this FPGA is appropriate for long-lived, ruggedized systems where predictable supply requirements, high I/O count and board-space efficiency are priorities.

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