M1A3PE1500-2FGG484I

The M1A3PE1500-2FGG484I is a ProASIC3E field programmable gate array (FPGA) IC designed for industrial applications. It provides a balance of logic density, on-chip memory, and I/O capacity in a compact 484-ball BGA package, suitable for designs that require moderate logic integration and a robust operating temperature range.

Key Features

• Logic Capacity — 38,400 logic elements (reported as logic element cells) supporting approximately 1,500,000 gates for implementing custom digital functions.
• Embedded Memory — Approximately 0.28 Mbits of embedded memory (276,480 total RAM bits) for buffering, FIFOs, and small on-chip storage.
• High I/O Count — 280 user I/O pins to support multiple interfaces, peripheral connections, and board-level integration.
• Power Supply — Operates from a defined core voltage range of 1.425 V to 1.575 V, enabling predictable power-supply planning.
• Package and Mounting — Supplied in a 484-FPBGA (23×23) package, designed for surface-mount assembly to save PCB area while providing high pin density.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C, appropriate for industrial environments.

Typical Applications

• Industrial Control — Industrial systems can leverage the −40°C to 100°C operating range and 280 I/Os for sensor and actuator interfacing and real-time control logic.
• Communications and Networking — The combination of 38,400 logic elements and abundant I/Os enables protocol handling, data switching, and custom packet processing.
• Instrumentation — On-chip memory and high gate count support data acquisition, buffering, and deterministic processing required in measurement instruments.

Unique Advantages

• Substantial Logic and Gate Count: 38,400 logic elements and ~1,500,000 gates allow implementation of complex custom logic blocks without external gate arrays.
• Compact, High-Density Package: The 484-FPBGA (23×23) package provides high pin count in a small footprint, reducing board area for densely packed designs.
• Robust Thermal Range: Industrial-grade operation from −40°C to 100°C supports deployment in harsh or variable-temperature environments.
• Large I/O Capability: 280 user I/Os enable extensive peripheral connectivity and flexible system partitioning.
• Defined Core Voltage Range: A narrow 1.425–1.575 V supply window simplifies power budgeting and voltage regulation design.

Why Choose M1A3PE1500-2FGG484I?

The M1A3PE1500-2FGG484I positions itself as a practical choice where moderate-to-high logic density, meaningful embedded memory, and a high number of I/Os are required in an industrial-temperature-capable device. Its 484-ball FPBGA package and surface-mount mounting make it suitable for space-conscious board designs that still demand extensive connectivity.

Designers targeting industrial control, communications, and instrumentation projects will find the combination of logic elements, on-chip RAM, and defined voltage and temperature ranges valuable for stable, long-term deployments. The device’s specifications support scalable custom logic solutions while simplifying system-level integration.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the M1A3PE1500-2FGG484I. Our team can provide a formal quote tailored to your project requirements.