M1A3PE1500-1FGG676I

The M1A3PE1500-1FGG676I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology designed for industrial applications. It provides 38,400 logic elements and approximately 0.28 Mbits of embedded memory in a high-density BGA package.

With 444 user I/Os, a 676-ball FBGA (27 × 27) supplier package, and an industrial operating temperature range, this device targets applications that require reconfigurable logic, significant I/O capacity, and a compact surface-mount form factor.

Key Features

• Core Logic  38,400 logic elements delivering a total of 1,500,000 gates for implementing complex logic functions.
• Embedded Memory  Approximately 0.28 Mbits of on-chip RAM (276,480 total RAM bits) for state storage and buffering.
• I/O Capacity  444 user I/Os to support high pin-count interfaces and multi-signal integration on a single device.
• Package & Mounting  676-ball FBGA (27 × 27) supplier package, packaged as a 676-BGA part case and designed for surface-mount assembly.
• Power  Core supply specified at 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Temperature Range  Rated for industrial operation from −40 °C to 100 °C to meet elevated environmental requirements.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Automation  Reconfigurable logic for controllers and interface aggregation where industrial temperature operation and high I/O count are required.
• Embedded Systems  Mid-to-high complexity embedded designs that benefit from 38,400 logic elements and on-chip RAM for custom logic and buffering.
• I/O-Intensive Interfaces  Systems that require a large number of signals to be routed and managed from a single FPGA, leveraging 444 user I/Os.

Unique Advantages

• Highly integrated logic capacity: 1,500,000 gates and 38,400 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board area.
• Ample embedded memory: Approximately 0.28 Mbits of on-chip RAM supports buffering and state retention without external memory.
• Large I/O density: 444 user I/Os accommodate complex, multi-interface designs and simplify signal routing.
• Industrial temperature tolerance: Specified operation from −40 °C to 100 °C for deployment in harsher environments.
• Compact BGA package: 676-FBGA (27 × 27) delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Regulatory alignment: RoHS compliance supports environmental requirements and supply-chain consistency.

Why Choose M1A3PE1500-1FGG676I?

The M1A3PE1500-1FGG676I ProASIC3E FPGA is positioned for industrial and embedded designs that need substantial logic resources, a large number of I/Os, and reliable operation across a wide temperature range. Its combination of 38,400 logic elements, significant on-chip RAM, and a compact 676-BGA package supports integration of complex functions while keeping board area and external component count down.

This device suits engineers and procurement teams building reconfigurable systems that require predictable core supply requirements and industrial-grade temperature performance. Backed by Microchip Technology’s ProASIC3E family, it offers a clear path for designs that demand scalability, integration, and regulatory compliance.

Request a quote or submit an inquiry for pricing and availability of the M1A3PE1500-1FGG676I to move your design forward.