M1A3P600L-1FG144
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA |
|---|---|
| Quantity | 781 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 177 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600L-1FG144 – ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA
The M1A3P600L-1FG144 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It delivers a balanced set of programmable logic resources, on-chip memory, and I/O capacity for custom digital designs.
Key architectural highlights include 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 bits), and 177 user I/Os, packaged in a 144-LBGA surface-mount package.
Key Features
- Core Logic 13,824 logic elements (reported as Number Of Logic Elements Cells) and approximately 600,000 gates enable implementation of medium-complexity digital functions.
- Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for storage, buffering, and scratchpad needs within user logic.
- I/O Capacity 177 user I/O pins provide broad connectivity options for peripheral interfaces and board-level signals.
- Power Supply Operates from a core voltage supply range of 1.14 V to 1.575 V, matching common low-voltage FPGA power architectures.
- Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting for compact board integration.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.
Unique Advantages
- Substantial Logic Capacity: 13,824 logic elements support implementation of significant custom logic without immediate need for larger devices.
- Integrated Memory: Approximately 0.11 Mbits of embedded RAM reduces external memory requirements for many buffering and state-storage tasks.
- High I/O Count: 177 I/Os enable dense board-level interfacing and multiple peripheral connections directly to the FPGA.
- Compact Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) balances pin count and PCB footprint for space-constrained designs.
- Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial applications and deployments.
- Manufacturer Backing: Produced by Microchip Technology and supplied as a RoHS-compliant component.
Why Choose M1A3P600L-1FG144?
The M1A3P600L-1FG144 positions itself as a versatile ProASIC3L FPGA option where a specific balance of logic density, on-chip RAM, and high I/O count is required. Its 13,824 logic elements, ~0.11 Mbits of embedded memory, and 177 I/Os make it suitable for designs that need significant programmable logic and local storage within a compact 144-LBGA footprint.
As a commercial-grade, RoHS-compliant device from Microchip Technology, it offers a clear specification set for engineers selecting components for standard-temperature embedded and electronic applications where these resource levels and package characteristics meet system requirements.
Request a quote or submit an inquiry to receive pricing and availability for the M1A3P600L-1FG144.

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