M1A3P600L-1FG144

IC FPGA 177 I/O 144FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA

Quantity 781 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600L-1FG144 – ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA

The M1A3P600L-1FG144 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It delivers a balanced set of programmable logic resources, on-chip memory, and I/O capacity for custom digital designs.

Key architectural highlights include 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 bits), and 177 user I/Os, packaged in a 144-LBGA surface-mount package.

Key Features

  • Core Logic  13,824 logic elements (reported as Number Of Logic Elements Cells) and approximately 600,000 gates enable implementation of medium-complexity digital functions.
  • Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for storage, buffering, and scratchpad needs within user logic.
  • I/O Capacity  177 user I/O pins provide broad connectivity options for peripheral interfaces and board-level signals.
  • Power Supply  Operates from a core voltage supply range of 1.14 V to 1.575 V, matching common low-voltage FPGA power architectures.
  • Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting for compact board integration.
  • Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Unique Advantages

  • Substantial Logic Capacity: 13,824 logic elements support implementation of significant custom logic without immediate need for larger devices.
  • Integrated Memory: Approximately 0.11 Mbits of embedded RAM reduces external memory requirements for many buffering and state-storage tasks.
  • High I/O Count: 177 I/Os enable dense board-level interfacing and multiple peripheral connections directly to the FPGA.
  • Compact Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) balances pin count and PCB footprint for space-constrained designs.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial applications and deployments.
  • Manufacturer Backing: Produced by Microchip Technology and supplied as a RoHS-compliant component.

Why Choose M1A3P600L-1FG144?

The M1A3P600L-1FG144 positions itself as a versatile ProASIC3L FPGA option where a specific balance of logic density, on-chip RAM, and high I/O count is required. Its 13,824 logic elements, ~0.11 Mbits of embedded memory, and 177 I/Os make it suitable for designs that need significant programmable logic and local storage within a compact 144-LBGA footprint.

As a commercial-grade, RoHS-compliant device from Microchip Technology, it offers a clear specification set for engineers selecting components for standard-temperature embedded and electronic applications where these resource levels and package characteristics meet system requirements.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3P600L-1FG144.

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