M1A3P600-2FG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

Quantity 83 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

The M1A3P600-2FG144I is a ProASIC3 FPGA from Microchip Technology, provided in a 144-ball L-BGA package with a 13×13 supplier footprint. It delivers a mid-range logic capacity with a combination of logic elements, internal RAM, and peripheral I/O suitable for industrial applications.

Key device characteristics include 13,824 logic elements (approximately 600,000 gates), roughly 0.11 Mbits of embedded memory, 97 I/O pins, a low-voltage supply range of 1.425 V to 1.575 V, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic 13,824 logic elements (equivalent to about 600,000 gates) for implementing glue logic, state machines, and custom digital functions.
  • Embedded Memory Approximately 0.11 Mbits of on-chip RAM for small data buffers, FIFOs, and distributed storage.
  • I/O Count 97 general-purpose I/O pins to support multiple peripheral interfaces and board-level connectivity.
  • Power Specified operating supply range of 1.425 V to 1.575 V to match low-voltage system domains.
  • Package & Mounting 144-LBGA package (supplier device package 144-FPBGA, 13×13) designed for surface-mount assembly.
  • Temperature & Grade Industrial-grade device with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial Control Leverages the industrial temperature rating and logic capacity for control, sequencing, and interface bridging in factory automation equipment.
  • Embedded Systems Uses the on-chip RAM and 13,824 logic elements to implement custom peripherals, protocol handling, and system glue in embedded designs.
  • Communications and Interface Logic 97 I/O pins allow implementation of protocol adapters, data routing, and signal conditioning between subsystems.

Unique Advantages

  • Balanced Logic and Memory: 13,824 logic elements alongside approximately 0.11 Mbits of embedded RAM provide the right mix for moderate-complexity digital functions and small data buffering.
  • Compact, Board-Friendly Package: 144-LBGA (144-FPBGA, 13×13) simplifies high-density PCB layouts while supporting surface-mount manufacturing processes.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in a wide range of environmental conditions.
  • Low-Voltage Operation: Narrow supply range (1.425 V to 1.575 V) suitable for systems designed around low-voltage power rails.
  • High I/O Count: 97 I/Os enable flexible interfacing to sensors, peripherals, and external logic without extensive board-level multiplexing.
  • Regulatory Compliance: RoHS compliance supports use in environments requiring lead-free component selection.

Why Choose M1A3P600-2FG144I?

The M1A3P600-2FG144I positions itself as a compact, industrial-grade FPGA solution that balances logic capacity, on-chip memory, and a substantial I/O complement in a 144-LBGA footprint. Its specified supply range and operating temperature make it suitable for designs that require predictable low-voltage operation and deployment in demanding environments.

This device is appropriate for engineers and procurement teams building control systems, embedded platforms, and interface logic where a midsize programmable fabric and high I/O density are required. Its combination of features supports scalable designs while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the M1A3P600-2FG144I.

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