M1A3P600-2FG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA |
|---|---|
| Quantity | 83 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-2FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA
The M1A3P600-2FG144I is a ProASIC3 FPGA from Microchip Technology, provided in a 144-ball L-BGA package with a 13×13 supplier footprint. It delivers a mid-range logic capacity with a combination of logic elements, internal RAM, and peripheral I/O suitable for industrial applications.
Key device characteristics include 13,824 logic elements (approximately 600,000 gates), roughly 0.11 Mbits of embedded memory, 97 I/O pins, a low-voltage supply range of 1.425 V to 1.575 V, and an industrial operating temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 13,824 logic elements (equivalent to about 600,000 gates) for implementing glue logic, state machines, and custom digital functions.
- Embedded Memory Approximately 0.11 Mbits of on-chip RAM for small data buffers, FIFOs, and distributed storage.
- I/O Count 97 general-purpose I/O pins to support multiple peripheral interfaces and board-level connectivity.
- Power Specified operating supply range of 1.425 V to 1.575 V to match low-voltage system domains.
- Package & Mounting 144-LBGA package (supplier device package 144-FPBGA, 13×13) designed for surface-mount assembly.
- Temperature & Grade Industrial-grade device with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Leverages the industrial temperature rating and logic capacity for control, sequencing, and interface bridging in factory automation equipment.
- Embedded Systems Uses the on-chip RAM and 13,824 logic elements to implement custom peripherals, protocol handling, and system glue in embedded designs.
- Communications and Interface Logic 97 I/O pins allow implementation of protocol adapters, data routing, and signal conditioning between subsystems.
Unique Advantages
- Balanced Logic and Memory: 13,824 logic elements alongside approximately 0.11 Mbits of embedded RAM provide the right mix for moderate-complexity digital functions and small data buffering.
- Compact, Board-Friendly Package: 144-LBGA (144-FPBGA, 13×13) simplifies high-density PCB layouts while supporting surface-mount manufacturing processes.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in a wide range of environmental conditions.
- Low-Voltage Operation: Narrow supply range (1.425 V to 1.575 V) suitable for systems designed around low-voltage power rails.
- High I/O Count: 97 I/Os enable flexible interfacing to sensors, peripherals, and external logic without extensive board-level multiplexing.
- Regulatory Compliance: RoHS compliance supports use in environments requiring lead-free component selection.
Why Choose M1A3P600-2FG144I?
The M1A3P600-2FG144I positions itself as a compact, industrial-grade FPGA solution that balances logic capacity, on-chip memory, and a substantial I/O complement in a 144-LBGA footprint. Its specified supply range and operating temperature make it suitable for designs that require predictable low-voltage operation and deployment in demanding environments.
This device is appropriate for engineers and procurement teams building control systems, embedded platforms, and interface logic where a midsize programmable fabric and high I/O density are required. Its combination of features supports scalable designs while maintaining compliance with RoHS requirements.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the M1A3P600-2FG144I.

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