M1A3P600-1PQ208I

The M1A3P600-1PQ208I is a flash-based ProASIC3 FPGA from Microchip Technology designed for industrial applications. It provides a mid-density programmable fabric with non-volatile flash configuration and Flash*Freeze technology for low-power operation.

Targeted at industrial and defense-related system designs, the device delivers a balance of logic capacity, embedded memory, and I/O count in a 208‑pin BFQFP surface-mount package for compact, board-level integration.

Key Features

• Core Logic — Approximately 13,824 logic elements (reported as 13,824 CLBs) and about 600,000 gates provide mid-density programmable logic for control and signal-processing tasks.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) to support FIFOs, buffers, and small data stores without external memory.
• I/O and Pinout — 154 user I/Os suitable for peripheral interfacing, sensor connections, and bus interfacing in mixed-signal systems.
• Non‑volatile Flash Architecture — Flash-based configuration with Flash*Freeze technology for reduced power modes and retention of configuration without external configuration memory.
• Package and Mounting — 208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for dense PCB layouts.
• Power and Supply — Core supply voltage range of 1.425 V to 1.575 V for predictable power planning and regulator selection.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for reliable operation in harsh environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial control and automation — Implement motor control logic, state machines, and real-time interfacing with sensors and actuators thanks to dense logic and ample I/O.
• Aerospace & defense subsystems — Use the flash-based, non-volatile configuration and industrial temperature rating for boards requiring retained configuration and extended environment operation.
• Communications equipment — Address protocol bridging, packet handling, and custom peripheral interfaces with available logic and embedded RAM.

Unique Advantages

• Mid-density programmable fabric: 13,824 logic elements and ~600k gates enable integration of multiple control and glue-logic functions, reducing external component count.
• On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports temporary data storage and small packet buffering without external memory.
• Flash-based non-volatile configuration: Eliminates the need for external configuration PROM and supports low-power configuration retention through Flash*Freeze technology.
• Robust environmental tolerance: Industrial temperature rating (−40 °C to 100 °C) and RoHS compliance facilitate deployment in demanding industrial and defense environments.
• High I/O count in compact package: 154 I/Os in a 208-BFQFP surface-mount package enable complex board-level integration while keeping PCB area manageable.
• Predictable power requirements: Defined core voltage range (1.425 V to 1.575 V) simplifies power-supply design and thermal planning.

Why Choose M1A3P600-1PQ208I?

The M1A3P600-1PQ208I positions itself as a reliable, flash-based FPGA choice for engineers needing mid-density logic, non-volatile configuration, and a practical mix of I/O and embedded memory in industrial temperature ranges. Its combination of approximately 13,824 logic elements, ~0.11 Mbits of on-chip RAM, and 154 I/Os makes it suitable for compact control systems, protocol conversion, and embedded signal processing tasks.

With a surface-mount 208‑BFQFP package and defined core supply and operating-temperature specifications, the device supports designs that require predictable power, board-level density, and operation across extended temperatures, backed by Microchip’s ProASIC3 family technology.

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