M1A3P600-1PQ208

The M1A3P600-1PQ208 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, delivering 13,824 logic elements and approximately 110,592 bits of on-chip RAM in a 208‑BFQFP surface-mount package. The device provides 154 general-purpose I/O pins and an internal gate count of 600,000, designed for embedded logic and system integration tasks.

Built for commercial-grade applications, the part operates from a 1.425 V to 1.575 V core supply and is specified for 0 °C to 85 °C operation. Series documentation identifies Flash*Freeze technology as a family-level feature.

Key Features

• Core Capacity  13,824 logic elements (logic cells) with a total gate count of 600,000, enabling medium-density programmable logic implementations.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support data buffering and local storage.
• I/O  154 user-configurable I/O pins for flexible interfacing and board-level connectivity.
• Power  Core supply voltage specified between 1.425 V and 1.575 V for consistent power provisioning in your design.
• Package & Mounting  208‑BFQFP (208-PQFP, 28 × 28 mm) surface-mount package for high-pin-count applications in a compact footprint.
• Operating Temperature  Commercial temperature range: 0 °C to 85 °C.
• Regulatory  RoHS compliant.
• Series Technology  Series documentation references Flash*Freeze technology as part of the ProASIC3 family feature set.

Typical Applications

• Custom Logic Acceleration  Use the 13,824 logic elements to implement user-defined digital functions and offload compute from microcontrollers or processors.
• I/O Expansion and Glue Logic  Deploy the 154 I/O pins for board-level interfacing, signal translation, and protocol bridging between subsystems.
• Embedded Control and Prototyping  Leverage the on-chip RAM and programmable logic for control tasks, state machines, and rapid prototyping of digital designs.

Unique Advantages

• High Logic Density: 13,824 logic elements and 600,000 gates provide substantial capacity for medium-complexity logic implementations without external ASICs.
• Integrated Memory Resources: Approximately 110,592 bits of embedded RAM reduce reliance on external memory for buffering and local data storage.
• Robust I/O Count: 154 I/O pins simplify system integration and reduce the need for additional interface components.
• Compact, High-Pin Package: The 208‑BFQFP (28 × 28 mm) package delivers high pin density in a surface-mount form factor suitable for space-constrained boards.
• Controlled Voltage Range: Tight core supply specification (1.425 V–1.575 V) supports predictable power design and supply sourcing.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose M1A3P600-1PQ208?

The M1A3P600-1PQ208 positions itself as a practical choice for engineers who need medium-density programmable logic with a substantial I/O complement and on-chip memory in a compact surface-mount package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded designs.

With a documented family feature set that includes Flash*Freeze technology and manufacturer support from Microchip Technology, the device offers a clear, specification-driven platform for designs that require flexible digital logic, local memory, and extensive I/O without forgoing manufacturability or RoHS compliance.

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