M1A3P600-1FGG484I

The M1A3P600-1FGG484I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed to deliver mid-density programmable logic with a broad I/O complement and on-chip RAM. Its architecture provides 13,824 logic elements and approximately 0.108 Mbits of embedded RAM for implementing custom digital logic and data buffering.

Targeted for industrial environments, this part combines a 1.425 V supply requirement with support for an operating temperature range from -40 °C to 100 °C and is available in a 484‑FPBGA (23x23) surface-mount package shipped in tray format.

Key Features

• Logic Density  Provides 13,824 logic elements for implementing a wide range of custom digital functions and state machines.
• On-Chip Memory  Includes 108,000 total RAM bits (approximately 0.108 Mbits) to support data buffering, FIFOs, and local storage for logic blocks.
• I/O Capacity  Offers 235 user I/O pins to accommodate complex interfacing requirements with sensors, peripherals, and external devices.
• Gate Count  Equivalent to 600,000 gates, enabling substantial combinational and sequential logic integration on a single device.
• Power  Operates at a supply voltage of 1.425 V, providing a defined power requirement for system power budgeting.
• Package & Mounting  Supplied in a 484‑FPBGA (23x23) package suitable for surface-mount PCB assembly; packaged in tray.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, supporting use in temperature-demanding environments.

Typical Applications

• Custom digital logic and prototyping  Implement complex state machines and bespoke processing blocks using the device's 13,824 logic elements and 600k-gate capacity.
• I/O‑rich embedded systems  Leverage 235 I/O pins to connect multiple peripherals, buses, or sensor arrays without external expander ICs.
• Industrial control and automation  Use the industrial temperature rating and on-chip RAM for reliable control logic and data buffering in industrial equipment.

Unique Advantages

• Balanced logic and memory  The combination of 13,824 logic elements and ~0.108 Mbits of RAM supports both control logic and local data storage without adding external memory.
• High I/O count  235 I/O pins reduce the need for additional interface components, simplifying board design and lowering BOM cost.
• Fixed single-supply requirement  A defined 1.425 V supply simplifies power-supply design and system integration.
• Robust operating range  An operating temperature span of -40 °C to 100 °C aligns with demanding environmental requirements for industrial deployments.
• Compact, surface-mount package  The 484‑FPBGA (23x23) package enables dense PCB layouts while supporting automated surface-mount assembly workflows.

Why Choose M1A3P600-1FGG484I?

The M1A3P600-1FGG484I positions itself as a versatile mid-density ProASIC3 FPGA option for designs that require a substantial logic element count, significant I/O capacity, and embedded RAM within an industrial temperature envelope. Its clear supply requirement and package format make it straightforward to integrate into production hardware.

This device is well suited for engineers and procurement teams building industrial control, I/O-heavy embedded systems, or custom digital logic solutions that benefit from on-chip resources and a 484‑FPBGA surface-mount footprint.

Request a quote today to obtain pricing and availability for the M1A3P600-1FGG484I and integrate this ProASIC3 FPGA into your next design.