M1A3P600-1FGG256I

The M1A3P600-1FGG256I is a ProASIC3 family flash-based Field Programmable Gate Array (FPGA) in a 256-LBGA package designed for industrial applications. It combines nonvolatile flash configuration with a high-density logic fabric—featuring 600,000 system gates and 13,824 logic elements—to enable compact, reprogrammable digital systems.

With approximately 108 kbits of embedded RAM (110,592 bits), 177 user I/Os, and a low-voltage core supply range (1.425 V to 1.575 V), this device targets designs that require instant-on, nonvolatile configuration, mixed-voltage I/O capability and robust operating range (-40 °C to 100 °C).

Key Features

• Capacity & Logic — Approximately 600,000 system gates and 13,824 logic elements provide a substantial logic resource set for mid-density FPGA designs.
• Embedded Memory — Approximately 108 kbits of on-chip SRAM (110,592 bits) suitable for FIFOs, buffers and small-data storage.
• Nonvolatile Flash Configuration — Flash-based reprogrammable configuration stores design when power is removed and enables Instant On behavior.
• I/O & Mixed-Voltage Support — 177 user I/Os in a 256-LBGA package; family-level mixed-voltage I/O options support multiple signaling standards and bank-selectable voltages.
• Clocking & PLLs — Family architecture includes clock conditioning circuitry with integrated PLLs to support flexible clocking and phase control.
• Performance — Family-level system performance up to 350 MHz for high-speed synchronous logic (as documented in the product family datasheet).
• Package & Mounting — 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) surface-mount package for compact board designs.
• Industrial Grade & Temperature Range — Specified operating range from -40 °C to 100 °C and marked industrial grade suitability.
• Power — Low-voltage core operation with a specified supply range of 1.425 V to 1.575 V for optimized power consumption.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital integration — Use as a reprogrammable logic fabric to consolidate glue logic, protocol bridges and control functions in compact systems.
• Instant-on embedded systems — Flash-based configuration enables systems that retain design and operate immediately after power-up without external configuration memory.
• Industrial control and automation — Industrial temperature rating and mixed-voltage I/O flexibility make the device suitable for control, monitoring and interface tasks.
• Secure configuration management — Nonvolatile flash configuration supports secure, persistent designs where firmware retention across power cycles is required.

Unique Advantages

• Nonvolatile, instant-on operation: Flash-based configuration retains programmed design when powered off and eliminates the need for external configuration memory.
• Mid-density logic with significant memory: 13,824 logic elements and approximately 108 kbits of embedded RAM provide balanced resources for control, buffering and data-path functions.
• Industrial-ready thermal range: Specified for -40 °C to 100 °C operation, enabling deployment in a wide range of industrial environments.
• Compact, surface-mount package: 256-LBGA (17 × 17 mm FPBGA) simplifies PCB routing while offering 177 user I/Os for flexible system integration.
• Low-voltage core operation: Narrow core supply range (1.425–1.575 V) supports low-power design strategies.
• ProASIC3 family capabilities: Built on Microchip’s flash FPGA architecture with family-level features such as clock conditioning/PLLs and on-chip FlashROM for system-level integration benefits.

Why Choose M1A3P600-1FGG256I?

The M1A3P600-1FGG256I positions itself as a reliable, mid-density flash FPGA for industrial applications that need nonvolatile configuration, solid logic capacity, and embedded memory in a compact package. Its combination of 600,000 system gates, 13,824 logic elements, approximately 108 kbits of on-chip RAM, and 177 I/Os makes it suitable for designers looking to reduce BOM complexity while keeping reprogrammability and instant-on capability.

This device is well suited to engineering teams developing compact, reprogrammable control systems, protocol bridging, or secure embedded logic where industrial temperature range, low-voltage core operation, and flash-based configuration add long-term value and design flexibility.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3P600-1FGG256I and to discuss how it fits your next design.