M1A3P600-1FGG144I

The M1A3P600-1FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It combines a sizeable logic fabric and on-chip RAM with a 97-pin I/O complement in a compact 144-LBGA package.

With 13,824 logic elements and approximately 0.11 Mbits of on-chip RAM, this device targets designs that require substantial programmable logic capacity, controlled power rails, and operation across an extended industrial temperature range.

Key Features

• Core Logic  13,824 logic elements (CLBs) supporting up to 600,000 gates for implementing custom digital functions.
• On-Chip Memory  Total RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for buffers, state machines, and local storage.
• I/O  97 general-purpose I/O pins to interface with external peripherals and system signals.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board designs.
• Operating Range  Industrial-grade temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for environmentally regulated designs.

Typical Applications

• Industrial Control  Implement custom logic and control functions that require operation across −40 °C to 100 °C.
• Embedded Systems  Use the 13,824 logic elements and on-chip RAM to integrate application-specific digital functions within compact, surface-mount designs.
• I/O-Driven Interfaces  Leverage 97 I/O pins to connect sensors, actuators, and external peripherals in moderate-complexity systems.

Unique Advantages

• High logic density: 13,824 logic elements and 600,000 gates enable implementation of substantial custom digital logic within a single device.
• On-chip RAM for local storage: Approximately 0.11 Mbits of embedded memory reduces dependence on external RAM for small buffers and state retention.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact LBGA package: 144-LBGA (144-FPBGA, 13×13) surface-mount package saves board area while providing a broad I/O complement.
• Controlled core voltage: Narrow supply range (1.425 V to 1.575 V) for predictable core operation in regulated designs.
• RoHS compliant: Facilitates use in designs that require environmental compliance.

Why Choose M1A3P600-1FGG144I?

The M1A3P600-1FGG144I positions itself as an industrial-grade FPGA option that balances substantial logic resources, on-chip RAM, and a sizeable I/O count in a compact 144-LBGA package. Its specified operating temperature range and RoHS compliance make it suitable for applications that require reliable operation in demanding environments.

This device is well suited to engineers seeking a Microchip Technology FPGA with significant programmable logic capacity, integrated memory, and a form factor that supports space-constrained, surface-mount system designs.

Request a quote or submit a request for pricing and availability to begin evaluating the M1A3P600-1FGG144I for your next design.