M1A3P600-2FG256

The M1A3P600-2FG256 is a ProASIC3 family FPGA from Microchip Technology. It provides a flash-based, reprogrammable, nonvolatile FPGA architecture tailored for high-density digital integration, offering an efficient platform for system logic, interface bridging, and prototyping where retain-on-power-off configuration and low-power operation are important.

This device combines 600,000 system gates with on-chip embedded memory and flexible I/O in a 256-LBGA surface-mount package, targeting commercial-temperature applications and RoHS-compliant designs.

Key Features

• Logic Capacity  Approximately 600,000 system gates realized as 13,824 logic elements for implementing complex digital functions and state machines.
• Embedded Memory  Approximately 0.108 Mbits (110,592 bits) of on-chip RAM to support FIFOs, buffers, and small data stores.
• I/O and Interfaces  Up to 177 user I/Os provided on the 256-LBGA package to support mixed-voltage interfaces and dense connectivity.
• Nonvolatile, Flash-Based Configuration  On-chip FlashROM (1 kbit family-level) enables reprogrammable, instant-on operation and retention of programmed designs when powered off.
• Programmability and Security  Family-level support for in-system programming (ISP) and AES-based secure programming mechanisms; see datasheet for device-level ISP details.
• Power Supply  Core supply range specified at 1.425 V to 1.575 V, enabling low-power core operation and compatibility with 1.5 V system designs.
• Package and Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17) surface-mount package for compact board implementation.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-density system integration  Use the M1A3P600-2FG256 to consolidate glue logic, protocol bridging, and custom peripherals into a single programmable device, reducing BOM count.
• ASIC replacement and prototyping  Leverage the device’s gate density and reprogrammable flash configuration to accelerate time-to-market and iterate designs prior to ASIC commitment.
• Embedded control and interface logic  Implement control state machines, peripheral interfaces, and timing-critical logic with available embedded RAM and extensive I/O.

Unique Advantages

• Highly integrated logic and memory: 600,000 system gates with 13,824 logic elements and on-chip RAM provide a compact platform for complex digital designs.
• Nonvolatile instant-on solution: Flash-based configuration retains programmed designs when power is removed, simplifying startup and secure deployment.
• Flexible I/O in a compact package: 177 user I/Os in a 256-LBGA package enable dense interface implementations while keeping PCB footprint small.
• Low-power core operation: Narrow core-voltage range supports efficient power profiles and compatibility with 1.5 V core systems.
• Commercial-temperature suitability and RoHS compliance: Designed for 0 °C to 85 °C operation and compliant with RoHS requirements for broader market acceptance.

Why Choose M1A3P600-2FG256?

The M1A3P600-2FG256 delivers a balanced mix of integration, memory, and I/O density in a flash-based FPGA architecture from Microchip Technology. Its combination of 600k system gates, substantial embedded RAM, and a 256-LBGA surface-mount package makes it well suited for designs that require reliable nonvolatile configuration, compact board area, and flexible connectivity at commercial temperatures.

Designers targeting ASIC-level integration without immediate ASIC commitment, or those building compact, low-power control and interface subsystems, will find this device a practical choice with a clear upgrade path within the ProASIC3 family. Refer to the datasheet for detailed device-level integration and programming options.

Request a quote or submit an inquiry for pricing and availability of M1A3P600-2FG256 to move your design from concept to production.